There is disclosed an antenna system comprising: i) first and second antennas, the second antenna being disposed laterally from the first along a longitudinal axis, and ii) an isolation structure disposed between the first and second antennas. The isolation structure comprises a first resonator element having a first arm with upper and lower ends, the first arm connected to ground at its lower end, and a lateral second arm connected to the upper end of the first arm. At least a portion of the first resonator element is disposed adjacent to a portion of the first antenna such that the first resonator element is strongly coupled to the first antenna.

A multiple-antenna device including a printed circuit board, a first antenna formed into a first corner of the printed circuit board, a second antenna formed into a second corner of the printed circuit board, and a dual-band decoupler formed in the printed circuit board between the first antenna and the second antenna. The multiple-antenna device includes WLAN circuitry located on the printed circuit board between the first antenna and the decoupler. The first and second antennas have polarizations orthogonal to each other.

A bridge network and an antenna module are provided. The antenna module includes n antennas, the bridge network includes n bridge modules, a third port of a 1.sup.st bridge module in the n bridge modules is connected to a second port of an n.sup.th bridge module in the n bridge modules, a third port of an i.sup.th bridge module in the n bridge modules is connected to a second port of an (i−1).sup.th bridge module in the n bridge modules, and fourth ports of the n bridge modules are respectively connected to the n antennas, where i is an integer greater than or equal to 2 and less than or equal to n, and n is an integer greater than or equal to 2.

Embodiments disclosed herein include package substrates with antennas on the core. In an embodiment, a package substrate comprises a core with a first surface and a second surface. In an embodiment, a first conductive plane is formed into the core, where the first conductive plane is substantially orthogonal to the first surface, and a second conductive plane is formed into the core, where the second conductive plane is substantially orthogonal to the first surface. In an embodiment, an antenna is on the core, where the antenna is between the first conductive plane and the second conductive plane.

Designs and techniques to enhance power-efficiency and incorporate new features in millimeter-wave MIMO transceivers are described. A new mechanism for built-in dual-band, per-element self-interference cancellation (SIC) is introduced to enable multi-antenna frequency-division duplex (FDD) and full-duplex (FD) operation. Additionally, several innovative circuit concepts are introduced, including low-loss wideband antenna interface design, dual-band power combining PA, dual-band RF-SIC design, and bi-directional MIMO signal.

An antenna apparatus includes a patch antenna pattern; a feed via electrically connected to the patch antenna pattern at a point offset in a first direction from a center of the patch antenna pattern; a first side coupling pattern spaced apart from the patch antenna pattern along a second direction and a second side coupling pattern spaced apart from the patch antenna pattern along the second direction and opposite to the first side coupling pattern; and a first side ground pattern spaced apart from the patch antenna pattern along the first direction and a second side ground pattern spaced apart from the patch antenna pattern along the first direction and opposite to the first side ground pattern. The patch antenna pattern and the first and second side coupling patterns are disposed between the first and second side ground patterns with respect to the first direction.

Flat RF tiles for multiple band electrical steerable antennas. To improve an antenna system for a communication between a vehicle and a satellite, a planar antenna array for multiple band satellite communication includes an array of flat RF tiles. Each RF tile includes a structure of antenna elements, wherein a first antenna element arrangement is configured to radiate in an uplink and downlink portion of a first satellite communication frequency band and a second antenna element arrangement is configured to radiate in an uplink and downlink portion of a second satellite communication frequency band.

A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

An antenna element with a filtering function, a filtering radiation unit, and an antenna. The antenna element is tubular, with a spiral slit arranged around the periphery of the tubular antenna element and extending in an axial direction. The filtering radiation unit includes a support column, and an upper part of the support column is electrically connected to at least one antenna element. The antenna includes a reflecting plate, and at least one filtering radiation unit is fixedly arranged on the reflecting plate. The antenna element with a filtering function has functions of radiating signals and suppressing interference simultaneously. The filtering radiation unit can cooperate with a high-frequency radiation element during use to achieve the aim of radiating a high-frequency signal and a low-frequency signal simultaneously. The antenna is good in performance, small in size, and high in integration degree.

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include a plurality of antenna patches coupled to a dielectric material and a plurality of pedestals extending from a face of the dielectric material and at least partially embedded in the dielectric material.