A multi-antenna system and an electronic device comprising the same. An intelligent multi-antenna solution in which antennas are laid out at the top, the side, and the bottom of an electronic device is used, so that three antenna groups including a top antenna group, a middle antenna group, and a bottom antenna group are respectively formed, and antenna performance in a plurality of scenarios such as a free-space scenario, a portrait-mode holding scenario, and a landscape-mode holding scenario is considered, to improve antenna radiation efficiency.

A multi-antenna system and an electronic device comprising the same. An intelligent multi-antenna solution in which antennas are laid out at the top, the side, and the bottom of an electronic device is used, so that three antenna groups including a top antenna group, a middle antenna group, and a bottom antenna group are respectively formed, and antenna performance in a plurality of scenarios such as a free-space scenario, a portrait-mode holding scenario, and a landscape-mode holding scenario is considered, to improve antenna radiation efficiency.

A unit cell can be used for a metasurface, metamaterial, or beamforming antenna. The unit cell includes a metal layer attached to a substrate. The metal layer defines an iris opening for the unit cell. One or more tunable capacitance devices are positioned within or across the iris opening. Each tunable capacitance device is to tune resonance frequency of the unit cell. Mass transfer technologies or self-assembly processes may be used to position the tunable capacitance devices.

A unit cell can be used for a metasurface, metamaterial, or beamforming antenna. The unit cell includes a metal layer attached to a substrate. The metal layer defines an iris opening for the unit cell. One or more tunable capacitance devices are positioned within or across the iris opening. Each tunable capacitance device is to tune resonance frequency of the unit cell. Mass transfer technologies or self-assembly processes may be used to position the tunable capacitance devices.

A mobile computing device including a modal antenna is disclosed. The mobile computing device may include a radio frequency circuit and a modal antenna mechanically coupled to a portion of the mobile computing at a location that is remote from the radio frequency circuit. The modal antenna may include a driven element and a parasitic element positioned proximate to the driven element. The modal antenna may be operable in a plurality of different modes. Each mode may be associated with a different radiation pattern. The mobile computing device may include a transmission line coupling the radio frequency circuit to the modal antenna. The radio frequency circuit may be configured to transmit an RF signal over the transmission line to the modal antenna and configured to communicate a control signal to adjust the mode of the modal antenna over the transmission line.

A mobile computing device including a modal antenna is disclosed. The mobile computing device may include a radio frequency circuit and a modal antenna mechanically coupled to a portion of the mobile computing at a location that is remote from the radio frequency circuit. The modal antenna may include a driven element and a parasitic element positioned proximate to the driven element. The modal antenna may be operable in a plurality of different modes. Each mode may be associated with a different radiation pattern. The mobile computing device may include a transmission line coupling the radio frequency circuit to the modal antenna. The radio frequency circuit may be configured to transmit an RF signal over the transmission line to the modal antenna and configured to communicate a control signal to adjust the mode of the modal antenna over the transmission line.

According to various embodiments of the disclosure, an electronic device may include: a first housing, a second housing, a printed circuit board (PCB), and a wireless communication circuit, wherein the first housing may include a first surface and a second surface perpendicular to the first surface at a first edge, and a first conductive area, and the first conductive area may include a first portion of a first slit extending from a point on the first surface to the first edge, a third surface of the second housing may include a second conductive area, and the second conductive area may include a second slit, wherein, in a first state, at least a portion of the first portion of the first slit may overlap the second slit when viewed in a second direction perpendicular to the first surface of the first housing, and wherein the wireless communication circuit may be configured to transmit and/or receive a signal of a first frequency band based on an electrical path including the first portion.

According to various embodiments of the disclosure, an electronic device may include: a first housing, a second housing, a printed circuit board (PCB), and a wireless communication circuit, wherein the first housing may include a first surface and a second surface perpendicular to the first surface at a first edge, and a first conductive area, and the first conductive area may include a first portion of a first slit extending from a point on the first surface to the first edge, a third surface of the second housing may include a second conductive area, and the second conductive area may include a second slit, wherein, in a first state, at least a portion of the first portion of the first slit may overlap the second slit when viewed in a second direction perpendicular to the first surface of the first housing, and wherein the wireless communication circuit may be configured to transmit and/or receive a signal of a first frequency band based on an electrical path including the first portion.

Disclosed herein is an antenna module that includes solder balls provided on a surface of the element body having an antenna element. The solder balls include a signal ball disposed at an intersection between the second row virtual line and the second column virtual line and first to fourth ground balls disposed, out of a plurality of intersections between the first to third row virtual lines and the first to third column virtual lines, at any of intersections other than those at which the signal ball is disposed. No solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.

Disclosed herein is an antenna module that includes solder balls provided on a surface of the element body having an antenna element. The solder balls include a signal ball disposed at an intersection between the second row virtual line and the second column virtual line and first to fourth ground balls disposed, out of a plurality of intersections between the first to third row virtual lines and the first to third column virtual lines, at any of intersections other than those at which the signal ball is disposed. No solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.