An antenna structure and a mobile device including the same are provided. The antenna structure is arranged on a metal cover with an opening slot, and includes a radiator, a feeding part, a grounding element, a grounding parasitic element, an extending parasitic element, a substrate, and a matching circuit. The radiator extends along a first direction, and the feeding part is connected to the radiator and extends towards a second direction. The grounding parasitic element includes a branch part and a parasitic element body. The branch part extends from a grounding point towards the opening slot. The parasitic element body is connected to the grounding element through the branch part and extends towards a first direction. The extending parasitic element extends along the first direction. The matching circuit is electrically connected to the radiator, the grounding element, the grounding parasitic element, and the extending parasitic element.

An antenna structure includes a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a dielectric substrate. The first radiation element is coupled to a ground voltage. The first radiation element includes a variable-width portion. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to the variable-width portion of the first radiation element. The fourth radiation element is coupled to the second radiation element. The dielectric substrate has a first surface and a second surface which are opposite to each other. The second radiation element and the fourth radiation element are disposed on the first surface of the dielectric substrate. The first radiation element and the third radiation element are disposed on the second surface of the dielectric substrate.

An antenna device according to an embodiment includes a dielectric layer, a rhombus-shaped first radiator disposed on an upper surface of the dielectric layer, a transmission line connected to the first radiator, a signal pad connected to one end of the transmission line, ground pads disposed around the signal pad, and second radiators extending from the ground pad along lower sides of the first radiator.

A convertible notebook computer includes a metal mechanism element, a first radiation element, a second radiation element, a third radiation element, a first parasitic element, a second parasitic element, a third parasitic element, and a dielectric substrate. The metal mechanism element has a closed slot. The first radiation element has a feeding point. The second radiation element is coupled to the first radiation element. The third radiation element is coupled to the first radiation element. The first parasitic element is adjacent to the second radiation element. The second parasitic element is adjacent to the third radiation element. The third parasitic element is adj acent to the first radiation element. An antenna structure is formed by the closed slot of the metal mechanism element, the first radiation element, the second radiation element, the third radiation element, the first parasitic element, the second parasitic element, and the third parasitic element.

A convertible notebook computer includes a metal mechanism element, a first radiation element, a second radiation element, a third radiation element, a first parasitic element, a second parasitic element, a third parasitic element, and a dielectric substrate. The metal mechanism element has a closed slot. The first radiation element has a feeding point. The second radiation element is coupled to the first radiation element. The third radiation element is coupled to the first radiation element. The first parasitic element is adjacent to the second radiation element. The second parasitic element is adjacent to the third radiation element. The third parasitic element is adj acent to the first radiation element. An antenna structure is formed by the closed slot of the metal mechanism element, the first radiation element, the second radiation element, the third radiation element, the first parasitic element, the second parasitic element, and the third parasitic element.

Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.

Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.

An antenna apparatus includes a ground plane; a first patch antenna pattern having a first bandwidth and spaced apart from the ground plane; a second patch antenna pattern spaced apart from the ground plane and the first patch antenna and overlapping at least a portion of the first patch antenna pattern; and guide vias disposed between the first patch antenna pattern and the ground plane and electrically connecting the first patch antenna pattern to the ground plane. The second patch antenna pattern has a second bandwidth corresponding a frequency higher than a frequency of the first bandwidth. The guide vias are disposed along a first side of the first patch antenna pattern.

A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.