Patent classifications
H01Q9/0414
Antenna Layer Structures Separated by Fluid-Filled Cavity, an Antenna Inlay, and a Component Carrier
An antenna radiation module for assembling to an antenna inlay for a component carrier or to a component carrier. The module includes a dielectric layer structure and an antenna radiation layer structure. The antenna radiation layer structure is embedded in the first dielectric layer structure. Further, an antenna inlay, a component carrier, and a manufacturing method are described.
ANTENNA DEVICE
An antenna device includes a differential antenna and a first balun. The differential antenna includes a first radiator, a first antenna port and a second antenna port connected to a first surface of the first radiator. Orthographic projections of the first antenna port and the second antenna port projected to the first radiator are symmetrical to a midpoint of the first radiator. The first balun is located on one side of the first surface of the first radiator, and its orthographic projection on the first plane where the first surface is located overlaps the first surface. The first balun includes a first port, a first wiring, a first coupling structure electrically connected to the first antenna port, and a second coupling structure electrically connected to the second antenna port. Neither the first coupling structure nor the second coupling structure directly contacts the first wiring.
ANTENNA STRUCTURE
An antenna structure includes a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, and a dielectric substrate. The first radiation element has a feeding point. The second radiation element is coupled to the first radiation element. The third radiation element is coupled to a first grounding point. The third radiation element is further coupled through the fourth radiation element to a second grounding point. The fifth radiation element is coupled to the third radiation element and the fourth radiation element. The fifth radiation element is adjacent to the second radiation element. The first radiation element and the second radiation element are at least partially surrounded by the third radiation element, the fourth radiation element, and the fifth radiation element.
Antenna module
An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
Cavity-backed antenna element and array antenna arrangement
The present disclosure relates to an antenna element (1) comprising a lower conducting plane (2), an upper conducting plane (3) and an upper dielectric layer structure (4) that is positioned between the conducting planes (2, 3). The upper dielectric layer structure (4) comprises a plurality of conducting vias (5) that electrically connect the conducting planes (2, 3) to each other and circumvent an upper radiating patch (6) formed in, below or above the upper conducting plane (3). The conducting vias (5) circumvent at least one intermediate radiating patch (7, 8) that is formed in the upper dielectric layer structure (4), and a lowest intermediate radiating patch (7) that is closest to the lower conducting plane (2) is connected to a feed arrangement (9, 10) that comprises at least one feeding probe (9, 10) that extends via a corresponding aperture (13) in the lower conducting plane (2) and is electrically connected to the lowest intermediate radiating patch (7).
Electronic device
The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.
ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). An antenna module is provided. The antenna module includes multiple antennas, a distribution circuit disposed to provide an electrical connection with each of the multiple antennas, a metal plate, and a dielectric substrate disposed between a pattern layer of the distribution circuit and the metal plate, wherein the dielectric substrate includes one or more dielectric film layers and one or more adhesive layers.
High gain and large bandwidth antenna incorporating a built-in differential feeding scheme
An antenna and a base station including the antenna. The antenna includes a sub-array that includes first and second unit cells and a feed network. The first and second unit cells comprise first and second patches, respectively, having quadrilateral shapes. The feed network comprises a first transmission line terminating below first corners of the first and second patches, respectively; a second transmission line terminating below third corners of the first and second patches, respectively; a third transmission line terminating below a second corner of the first patch and a fourth corner of the second patch; and a fourth transmission line terminating below a fourth corner of the first patch and a second corner of the second patch. The first corners are opposite the third corners on the respective first and second patches and the second corners are opposite the fourth corners on the respective first and second patches.
ANTENNA DEVICE
An antenna device according to embodiment includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed in a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed in the first surface of the first dielectric layer, wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the first dielectric layer and a dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.
Antenna structure and electronic device including the same
The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments in the present disclosure, an antenna device for dual polarization of a wireless communication system, comprises a print circuit board (PCB); a first feeding line configured to provide a first polarization signal; a second feeding configured to provide a second polarization signal; and a patch antenna comprising a radiating region and cutting regions. Objects corresponding to the cutting regions are disposed to support the radiating region on the PCB.