A millimeter-wave antenna-in-package includes a substrate, and a radiation structure and a first antenna feeder that are disposed in the substrate. The first antenna feeder includes an antenna matching stub, a feeder transmission strap, and a first harmonic suppression unit. A first end of the antenna matching stub is connected to the radiation structure. The first harmonic suppression unit includes a first transmission part and a first bent part. A first end of the first bent part is connected to a first end of the first transmission part, and a second end of the first bent part and a second end of the first transmission part form a first opening. A second end of the antenna matching stub is connected to the feeder transmission strap through the first transmission part, and the feeder transmission strap extends along the first reference direction.

A parasitically-coupled dual-band patch antenna is described. The antenna includes an inner conductor having one or more feed holes. The antenna also includes an outer conductor surrounding the inner conductor in a radial direction. The antenna further includes one or more feeds each having a vertical portion that passes through the feed holes and a horizontal portion that extends in an outward direction from the feed holes toward the outer conductor. The feeds are conductively connected to the outer conductor. The horizontal portion of each of the feeds is separated from and is conductively disconnected from a top surface of the inner conductor.

This document describes low-footprint dual-band ultra-wideband (UWB) antenna modules. A described UWB antenna module may be used as an internal part of a mobile device (e.g., cellphone, tablet, and/or other mobile devices). The UWB antenna module includes a multi-layer dual-band antenna that includes a set of multi-layer patch antennas, each patch antenna including a layer with a conductive ground plate, a feeding plate layer, and a parasitic strip layer with two parasitic strips, one configured to resonate at a frequency within a first band of the dual-band antenna, the other configured to resonate at a frequency within a second band of the dual-band antenna. The parasitic strips are electromagnetically coupled to the feeding plate.

An antenna element includes a dielectric substrate, a radiation electrode, a first ground electrode, a second ground electrode, and a via conductor that connects the first ground electrode and the second ground electrode to each other. The dielectric substrate includes a flat-plate-shaped first part and a second part that is thinner than the first part. The radiation electrode and the first ground electrode are arranged on or in the first part so as to face each other in the thickness direction of the first part. The second ground electrode is spaced apart from the radiation electrode. The second ground electrode is arranged on or in the second part so as to not face the radiation electrode in the thickness direction of the second part. The radiation electrode is capacitively coupled to the second ground electrode and the via conductor.

A communication system in a housing including a first communication device and a second communication device has, in at least one of the first communication device and the second communication device, an antenna structure installed at a position between a device arrangement surface and a specific surface. The housing has an inside member arranged substantially in parallel with a battery arrangement surface at a position at least one of above and below the antenna structure. The inside member has, formed thereon, at least one opening that opens in a vertical direction. The at least one of the first communication device and the second communication device serving as a specific communication device include an antenna having directivity set in a predetermined direction range including at least a direction in which the opening of the inside member is located.

A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

An information handling system (IHS) includes an antenna system. The antenna system includes an antenna; a radiating element, the radiating element being capacitively coupled with the antenna; and, a tuner module electrically coupled to the antenna and the radiating element, the tuner module tuning the antenna and the radiating element.

An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.

Disclosed is an electronic device. The electronic device includes: an antenna structure including at least one antenna and at least one processor operatively connected with the antenna structure. The antenna structure includes: a first conductive patch including a first edge and a second edge parallel to the first edge, a first transmission line electrically connected to a first point of the first conductive patch, a second conductive patch spaced apart from the first conductive patch by a specified distance and including a third edge at least partially facing the second edge of the first conductive patch and a fourth edge parallel to the third edge, and a second transmission line electrically connected to a second point of the second conductive patch. The first point of the first conductive patch and the second point of the second conductive patch are located on the second edge of the first conductive patch and the third edge of the second conductive patch or on the first edge of the first conductive patch and the fourth edge of the second conductive patch.

An antenna structure includes a ground element, a first radiation element, a second radiation element, a dielectric substrate, a first feeding element, a second feeding element, a third feeding element, and a fourth radiation element. The dielectric substrate has a first surface and a second surface. The first radiation element is disposed on the first surface. The second radiation element is adjacent to the first radiation element, and is separate from the first radiation element. The first feeding element has a first feeding port, and is coupled to the first radiation element. The second feeding element has a second feeding port, and is coupled to the first radiation element. The third feeding element has a third feeding port, and is coupled to the first radiation element. The fourth feeding element has a fourth feeding port, and is coupled to the first radiation element.