An antenna module is proposed in which a slit and a through-hole for grounding are additionally formed in a single radiator such that the antenna module resonates in two frequency bands or expands the bandwidth around a reference resonant frequency. The proposed antenna module includes a radiator having a first slit, and the radiator is divided into a first region and a second region with respect to the first slit, wherein a plurality of first through-holes and a second slit are formed in the first region, a second through-hole is formed in the second region, and a power feeding pattern is connected to a region between the first slit and the second slit in the first region.

Provided is a 5G dual port beamforming antenna. The beamforming antenna according to an embodiment of the present disclosure includes a plurality of patch antennas, and the patch antenna includes: a first patch positioned on an upper portion; a second patch positioned on a left side under the first patch and having a plurality of feeding ports formed thereon; a third patch positioned on an upper portion of a right side of the second patch; and a fourth patch positioned on a lower portion of the right side of the second patch. Accordingly, 3D wide angle beamforming is possible in an antenna to be used in 5G mobile communication systems, military radar systems, etc.

An antenna device includes a ground plane, a first feed via and a second feed via for penetrating the ground plane through a first hole and a second hole of the ground plane, a first feed pattern connected to the first feed via, a first antenna pattern configured to be coupled to the first feed pattern and transmit/receive an RF signal of a first frequency bandwidth, a second antenna pattern connected to the second feed via and configured to transmit/receive an RF signal of a second frequency bandwidth, and a third antenna pattern disposed between the first antenna pattern and the second antenna pattern, and overlapping the first antenna pattern and the second antenna pattern.

This application provides a wearable device. The wearable device includes a cover, a screen component, an antenna bracket, a first antenna, a metal middle frame, a circuit board, and a bottom cover. The cover and the bottom cover are respectively connected to two sides of the metal middle frame, the screen component is connected to a side of the cover facing the bottom cover, and the circuit board is located in a space enclosed by the metal middle frame, the screen component, and the bottom cover. An accommodating space is jointly enclosed by an end of the screen component, an inner wall of the metal middle frame, and an inner wall of the cover, the antenna bracket is disposed in the accommodating space, and the first antenna is disposed on the antenna bracket and is connected to the circuit board by using a feedpoint.

An antenna device includes a first antenna and a second antenna. The first antenna receives or transmits first radio frequency signals to a first direction. The second antenna receives or transmits second radio frequency signals to a second direction. The first direction is different from the second direction. The first antenna and the second antenna share radiators.

An antenna structure includes a ground element, a feeding radiation element, a shorting radiation element, a connection radiation element, a first radiation element, and a second radiation element. The feeding radiation element has a feeding point. The feeding radiation element is coupled through the shorting radiation element to the ground element. The connection radiation element is coupled between the first radiation element and the shorting radiation element. The second radiation element is coupled to the feeding radiation element. A coupling slot region is formed and substantially surrounded by the feeding radiation element, the shorting radiation element, the connection radiation element, the first radiation element, and the second radiation element.

An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.

An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include heatsink portions and radio frequency antenna portions. The heatsink portions may provide a path for dissipating thermal energy or heat generated by the components in the device (e.g., printed circuit boards, processors, voltage amplifiers, etc.), and the radio frequency (RF) antenna portions may allow the device to send and receive wireless communications. The integrated heatsink and antenna structure may be formed so that radio frequency antenna portions operate to improve the thermal performance of the heatsink portions and/or so that the heatsink portions operate to improve the antenna properties (e.g., radiation patterns, radiation efficiency, bandwidth, input impedance, polarization, directivity, gain, beam-width, voltage standing wave ratio, etc.) of the radio frequency antenna portions.

A circularly polarized, multiband, and wideband antenna and can communicate with a GPS system. The antenna may include a driving element, first, second and third conductive parasitic elements electrically connected to the driving element, and a ground plane. The parasitic elements are provided with different lengths to provide for wider band operation with multiple resonant frequencies. The radiated wave has a low angle of propagation and travels for at least 1-2 miles.

A semiconductor device having an integrated antenna is provided. The semiconductor device includes a base die having an integrated circuit formed at an active surface and a cap die bonded to the backside surface of the base die. A metal trace is formed over a top surface of the cap die. A cavity is formed under the metal trace. A conductive via is formed through the base die and the cap die interconnecting the metal trace and a conductive trace of the integrated circuit.