A three-dimensional electronic component includes a first surface, a second surface, a third surface, and a fourth surface, and an antenna structure. The antenna structure includes a first radiating metal portion, a second radiating metal portion, an adjusting metal branch, a first ground connection portion, a second ground connection portion, a feed point, and a ground point. The first radiating metal portion on the first surface extends to the second surface. The second radiating metal portion on the first surface extends to the third surface. A gap is between the first radiating metal portion and the second radiating metal portion. The adjusting metal branch on the first surface is connected to the first radiating metal portion. The feed point on the first radiating metal portion is close to the gap. The ground point on the second radiating metal portion is close to the gap.

The present disclosure provides an antenna, an antenna device, a fabricating method of the antenna, and a fabricating method of the antenna device, and relates to the field of antenna technology. The antenna includes a first substrate; a base material layer on the first substrate and having a plurality of antenna cavities arranged in an array therein; and a conductive layer on an inner side of each of the plurality of antenna cavities, each of the plurality of antenna cavities and the conductive layer on the inner side thereof forming an antenna unit, wherein each of the plurality of antenna cavities includes a first opening, and an aperture of the first opening at a position of the antenna cavity close to the first substrate is smaller than an aperture of the first opening at a position of the antenna cavity away from the first substrate.

A substrate that includes at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the substrate. The curved antenna is curved relative to the surface of the substrate such that at least part of the curved antenna is offset from the surface of the substrate. The substrate includes a first antenna dielectric layer coupled to the surface of the substrate, an antenna ground interconnect coupled to the first antenna dielectric layer, and a second antenna dielectric layer coupled to the antenna ground interconnect. The antenna ground interconnect configured to be coupled to ground. The curved antenna is coupled to the second antenna dielectric layer.

A dual band antenna (AN) configured for being position on a surface of a pit lid and capable of wireless signal transmission at two frequency bands in response to an electrical signal applied via a feed wire. A convex conductive surface, e.g. 5 dome-shaped, is placed above a conductive ground plane element, wherein at least a part of an edge, e.g. 20-40% of the edge, of the dome-shaped radiator element is in electrical contact with the conductive ground plane element. Further, the convex conductive surface is connected via the feed wire. This antenna design allows first and second resonance frequencies within a factor of such as 1.8-2.2, 10 which allows the antenna to be designed e.g. for both of the frequency bands 450-470 MHz and 902-928 MHz which are relevant for meter reading data and with smaller dimension than what could be expected from conventional antennas. A housing with a convex top surface forms an enclosure around the antenna parts conductive ground plane element and the dome-shaped radiator element, the 15 housing has a bottom surface arranged to face the surface of the pit lid, and where the feed wire exits the housing.

Apparatus and techniques described herein can include antenna configurations and related fabrication. For example, a Z-axis meandering antenna configuration can be fabricated, such as by forming a dielectric substrate extending in two dimensions and defining an undulating region extending out of a plane defined by the two dimensions; and forming at least one conductive region following a contour of the dielectric substrate including at least a portion of the undulating region. The at least one conductive region can follow the contour of the dielectric substrate, such as including a first conductive region on a first layer, and a second conductive region on another layer separate from the first conductive region of the first conductive layer.

An electronic device includes a ring-shaped antenna element, a conductor and a dielectric. The conductor has the same potential as GND. The dielectric is interposed between the antenna element and the conductor. The antenna element, the dielectric and the conductor are disposed so as to lie on top of one another in plan view.

A semiconductor device package is provided that incorporates an antenna structure within the package through use of three-dimensional additive manufacturing processes. Embodiments can provide semiconductor device packages that are thinner than traditional device packages by depositing specific metal and dielectric layers within the package in desired positions with precision that cannot be provided by other manufacturing techniques. Further, embodiments can provide antenna geometries and orientations that cannot be provided by other manufacturing techniques.

A field device of automation technology, including: an at least partially metal housing having at least one housing opening; a field device electronics arranged within the housing; a cable gland, which is located in the housing opening, wherein at least one cable extends through the cable gland into the housing and is connected with the field device electronics such that wired communication can occur via the cable with the field device electronics; and an antenna for transmitting and/or receiving electromagnetic waves having at least one determined wavelength, wherein the antenna is situated in the cable gland such that the antenna at least partially surrounds the cable, and wherein the antenna is connected with the field device electronics via a coaxial cable such that wireless communication can occur via the antenna with the field device electronics.

A communication antenna and radiation unit thereof with tapered clearance slots for transceiving radiation signals disposed at four corners of the radiation unit. The slots form groups and are arranged and fed by two feeding units. A middle portion of the radiation unit is a flat central platform. Peripheries of the radiation unit are turned up to form folded edges. The communication antenna includes a reflecting plate and a radiation unit operating at a low frequency. The central platform has a high-frequency radiation element. The radiation unit has a small aperture and is lightweight, so the antenna size is reduced, and a radiation performance indicator can be ensured. The radiation unit is applied to a multi-frequency antenna, has little effect on a high-frequency oscillator, and is especially suitable for a multi-frequency base station antenna with a low-frequency unit and a high-frequency unit forming an array in a nested manner.

The preset invention relates to a dual polarized antenna and an antenna array and, more particularly, to a dual polarized antenna comprising: a top portion having a radiation patch; a bottom portion forming a probe; and side portions formed along the outer peripheral edge of the top portion so as to have a predetermined height, wherein the side portions include a cup-shaped aluminum structure, and the top portion, the bottom portion, and the side portions are formed in an integrated form.