Patent classifications
H01Q9/0471
Self-forming travelling wave antenna module based on single conductor transmission lines for electromagnetic heating of hydrocarbon formations and method of use
An apparatus and method for electromagnetic heating of a hydrocarbon formation is presented. The apparatus is a radio frequency antenna module in a radio frequency antenna for delivering electromagnetic energy generated by a generator into the hydrocarbon formation. The antenna module comprises: a conductive member; at least one conductive sheath with a first and second end surrounding at least one portion of the conductive member; at least one electrical coupler electrically coupled to the conductive member and the at least one conductive sheath for receiving the electrical energy; and an electrically insulating seal inserted at the first and second end of each of the at least one conductive sheath between the conductive member and the conductive sheath to maintain an enclosed cavity defined by the conductive member, the conductive sheath and the electrically insulating seal.
Half-patch launcher to provide a signal to a waveguide
An apparatus includes a first conductive patch coupled to a first surface of a dielectric layer, a second conductive patch coupled to a second surface of the dielectric layer, and a probe coupled to the second conductive patch. The apparatus further includes a waveguide having a wall conductively coupled to the first conductive patch. Responsive to a signal provided to the second conductive patch by the probe, interaction of the waveguide, the first conductive patch, and the second conductive patch generates a transmission signal that propagates in the waveguide.
Semiconductor device
A semiconductor device that generates or detects terahertz waves includes a semiconductor layer that has a gain of the generated or detected terahertz waves; a first electrode connected to the semiconductor layer; a second electrode that is arranged at a side opposite to the side at which the first electrode is arranged with respect to the semiconductor layer and that is electrically connected to the semiconductor layer; a third electrode electrically connected to the second electrode; and a dielectric layer that is arranged around the semiconductor layer and the second electrode and between the first electrode and the third electrode and that is thicker than the semiconductor layer. The dielectric layer includes an area including a conductor electrically connecting the second electrode to the third electrode. The area is filled with the conductor.
ANTENNA DEVICE
An antenna device according to an embodiment includes a dielectric layer, an antenna unit disposed on a top surface of the dielectric layer and including a radiator, and a dummy mesh pattern disposed around the antenna unit and spaced apart from the antenna unit. The dummy mesh pattern includes conductive lines and segmented regions at which the conductive lines are cut. The segmented regions formed in three parallel conductive lines neighboring each other among the conductive lines are not disposed together on an imaginary straight line extending perpendicularly to an extending direction of the conductive lines. A visual recognition of the antenna unit is prevented.
Method to Embed an Antenna Within a Composite Panel
A composite member that includes plies of composite material and an integral antenna. The integral antenna includes one or more plies of conductive material. A pin is connected to and extends outward from one of the conductive plies. The pin extends through openings in one or more of the composite plies that are positioned between and/or around the one or more plies of conductive material.
Antenna assembly and electronic apparatus
An antenna assembly may include an excitation source configured to generate an excitation signal, an antenna radiator including a first end and an opposing second end, a reference ground disposed corresponding to the antenna radiator, adjacent to the first end and including a first surface adjacent to the first end and an opposing second surface adjacent to the second end, a support body arranged on the second surface of the reference ground and extending along a direction from the first end to the second end, and a conductive sheet arranged on the support body, adjacent and coupled to the second end and configured to transmit the excitation signal from the excitation source to the antenna radiator, the antenna radiator may be configured to generate an electromagnetic signal according to the excitation signal.
HALF-PATCH LAUNCHER TO PROVIDE A SIGNAL TO A WAVEGUIDE
An apparatus includes a first conductive patch coupled to a first surface of a dielectric layer, a second conductive patch coupled to a second surface of the dielectric layer, and a probe coupled to the second conductive patch. The apparatus further includes a waveguide having a wall conductively coupled to the first conductive patch. Responsive to a signal provided to the second conductive patch by the probe, interaction of the waveguide, the first conductive patch, and the second conductive patch generates a transmission signal that propagates in the waveguide.
Wireless microphone comprising a plurality of antennas
One embodiment provides a wireless microphone comprising a microphone body a plurality of antennas positioned at different locations of the microphone body. Each of the plurality of antennas is configured to wirelessly transmit data. The wireless microphone further comprises a sensor configured to detect an object within proximity of an antenna of the plurality of antennas that obstructs the antenna, and a controller configured to switch antenna operation of the wireless microphone from the antenna to another antenna of the plurality of antennas in response to the object detected.
Semiconductor Package with Compact Antenna Formed Using Three-Dimensional Additive Manufacturing Process
A semiconductor device package is provided that incorporates an antenna structure within the package through use of three-dimensional additive manufacturing processes. Embodiments can provide semiconductor device packages that are thinner than traditional device packages by depositing specific metal and dielectric layers within the package in desired positions with precision that cannot be provided by other manufacturing techniques. Further, embodiments can provide antenna geometries and orientations that cannot be provided by other manufacturing techniques.
Millimeter Wave Patch Antennas
An electronic device may include a millimeter wave antenna having a ground plane, resonating element, feed, and parasitic element. The resonating element may include first, second, and third layer of traces that are shorted together. The second traces may be interposed between the first and third traces and the third traces may be interposed between the second traces and the parasitic. The third traces may have a width that is less than the widths of the second and third traces. The third traces and the parasitic may define a constrained volume having an associated cavity resonance that lies outside of a frequency band of interest. If desired, the resonating element may include a single layer of conductive traces having a grid of openings that disrupt impedance in a transverse direction, thereby mitigating the trapping of energy within the frequency band of interest between the resonating element and the parasitic.