A dual-polarized antenna structure is provided. The dual-polarized antenna structure includes an insulating substrate, two first antennas, two second antennas, a coupling unit, and two feeding points. The two first antennas are disposed on two sides of the insulating substrate, respectively. The two second antennas are disposed on the two sides of the insulating substrate, respectively. Each of the two second antennas includes two sub-antennas. In any one of the two sides of the insulating substrate, a region defined by orthogonally projecting two sub-middle segments of the two sub-antennas onto another one of the two sides of the insulating substrate overlaps with a main middle segment of the first antenna. The coupling unit is electrically coupled to the two sub-antennas on each of the two sides of the insulating substrate. The two feeding points are electrically coupled to the two first antennas and the two second antennas.

An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

An antenna array may include a plurality of printed circuit boards (PCBs) oriented in a stacked arrangement, parallel to and spaced apart from one another. Each of the PCBs may include a linear array of antenna elements, which cooperate with the linear arrays of antenna elements on other PCBs to form a two-dimensional array of antenna elements. The PCBs may be supported at one end by a common backplate in a cantilevered manner, with the linear arrays of antenna elements located near the free end of the PCBs. The PCBs may include a thicker portion and a thinner portion, and the thinner portion may include a heat sink or other thermal dissipation structure.

A dipole antenna fed by a planar balun includes a first radiation element and a second radiation element respectively corresponding to poles of the dipole antenna, at least one dipole support column configured to connect the first radiation element and the second radiation element and to fix a gap between the first radiation element and the second radiation element, a planar balun connected to the first radiation element and the second radiation element and configured to feed the first radiation element and the second radiation element, and a balun housing coupled to the dipole support column and enclosing the planar balun.

An electronic device provided with an antenna is provided according to one embodiment. The electronic device comprises: a first radiator disposed inside a first substrate, and radiating a first signal, having a first polarization, in the direction of the side surface of the first substrate; a second radiator disposed on a second substrate which is disposed perpendicular to the first substrate, and radiating a second signal, having a second polarization perpendicular to the first polarization, in the direction of the side surface of the first substrate; and a transceiver circuit disposed on the rear of the first substrate, and transmitting or receiving at least one of the first signal and the second signal through at least one of the first radiator and the second radiator.

An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member and a plurality of conductive vias. The substrate contains liquid crystal polymer and has opposite first and second surfaces. The reflective plates are arranged in an array on the first surface of the substrate. The grounding plate is arranged on the second surface of the substrate and overlaps with the reflective plates in a normal direction of the substrate. The radiating member is on the second surface of the substrate and does not overlap with the reflective plates in the normal direction of the substrate. The radiating member has an open slot which is defined by a first radiating branch and a second radiating branch that generate at least two different operating frequency bands. The conductive vias respectively penetrate the substrate and connect with the reflective plates and the grounding plate.

An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas and transceiver circuitry such as millimeter wave transceiver circuitry. The antennas may be formed from metal traces on printed circuits. A flexible printed circuit may have an area on which the transceiver circuitry is mounted. Protruding portions may extend from the area on which the transceiver circuitry is mounted and may be separated from the area on which the transceiver circuitry is mounted by bends. Antenna resonating elements such as patch antenna resonating elements and dipole resonating elements may be formed on the protruding portions and may be used to transmit and receive millimeter wave antenna signals through dielectric-filled openings in a metal electronic device housing or a dielectric layer such as a display cover layer formed from glass or other dielectric.

A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.

An electronic device is provided. The electronic device includes an outer housing that comprises a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding a space between the first surface and the second surface, a display adapted to expose at least a portion of the display through the first surface of the outer housing, a PCB arranged between the second surface and the display in an interior of the outer housing, a communication circuit arranged on or over the PCB, a first conductive structure formed of at least one of the first surface or at least a portion of the side surface is electrically connected to the communication circuit, and a second conductive structure formed of the portion of the display electrically connected to the first conductive structure.

A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.