Provided are a multi-function card that has a non-contact IC card function, a magnetic stripe card function, and a function of generating a magnetic card signal and an NFC signal, a Bluetooth function capable of transmitting a signal to devices such as smartphones, includes a metallic frame, and is robust against bending or breakage, a transmission/reception sensor system used for the multi-function card or the like, and a wearable device, and the transmission/reception sensor system includes a magnetic sensor 10 including a coil 2 wound around a magnetic sensor core 1, an NFC coil 12 formed in a planar shape, and a metallic frame 13a of a loop shape which is installed along the NFC coil 12 and includes one or more cut portions.

A communication device includes a system ground plane, a signal source, an antenna structure, a radiation adjustment plane, and at least one tuning metal element. The signal source is coupled to the system ground plane. The antenna structure is coupled to the signal source. The radiation adjustment plane is configured to adjust the radiation of the antenna structure. The tuning metal element is disposed adjacent to the antenna structure, and is configured to modify the radiation pattern of the antenna structure.

An antenna structure includes an antenna radiator, a microstrip line, a flexible board, and a coaxial cable. The antenna radiator is used to receive and transmit wireless signals. The wireless signals include radio frequency signals. The microstrip line is coupled to the antenna radiator and is used to transmit the radio frequency signals. The flexible board is coupled to the microstrip line and is used to transmit the radio frequency signals. The coaxial cable is coupled to the flexible board and is used to transmit the radio frequency signals to a processor.

A planar multi-layer assembly method fabricates a dual frequency, dual polarization phased-array antenna. A plurality of vias make up an array of double-walled wells which are connected to a ground plane. A shorted annular ring patch antenna (SARPA) is deposited at the top of each double-walled well. Fabricated coaxially and parallel to each SARPA, is an array of circular patch antennas (CPA). The inner wall of each double-walled well improves isolation of the CPA signals from the SARPA signals. Each SARPA of the array is connected to a pair of first frequency band signal vias and the CPA is coupled to a pair of second frequency band signal vias. Within each frequency band, a plurality of signal phases enable steerable polarized antenna beams.

A method of incorporating a second conductor into a RFID strap device and the resulting device in multiple embodiments is disclosed. The second conductor adds functionality via coupling between the strap conductor and the second conductor. The functionality added can be a secondary antenna operating at a different frequency than the first antenna that is driven by the strap pads, a sensing capability, a drive for an emissive device such as an LED, or an interface to one or more semiconductor devices mounted onto the second conductor.

The present disclosure belongs to the field of radio frequency circuit design, and in particular relates to a M×N millimeter wave and terahertz planar dipole end-fire array antenna. The M×N millimeter wave and terahertz planar dipole end-fire array antenna is composed of M paths of N× end-fire linear array antennas arranged at equal intervals, and the distance d between two adjacent N× end-fire linear array antennas is less than λ, where λ is the wavelength, and both M and N are integers greater than 1. By connecting linear type feed networks of the M paths of N× end-fire linear array antennas to M-path in-phase radio frequency signal transmitter and controlling the distance between two adjacent N× end-fire linear array antennas to be less than the effective wavelength, a higher gain and a higher half-power width can be realized, and the power consumption of the transmitter can be reduced.

An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.

An antenna comprising at least one antenna bay comprising an input port; a feed network and a radiative component is provided. The feed network has a center node connected to the input port; a printed circuit board (PCB), comprising an active surface having at least two feed micro-strips and a reference surface having at least two first reference micro-strips, the reference surface being opposite to the active surface. The radiative component has at least two dipoles, each of the at least two dipoles being shaped as a helix and being uniformly disposed about an antenna axis, each of the at least two dipoles comprising a dipole feeded portion connected to one of the at least two feed micro-strips and a dipole reference portion connected to one of the at least two first reference micro-strips.

An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.

An antenna array may include a plurality of printed circuit boards (PCBs) oriented in a stacked arrangement, parallel to and spaced apart from one another. Each of the PCBs may include a linear array of antenna elements, which cooperate with the linear arrays of antenna elements on other PCBs to form a two-dimensional array of antenna elements. The PCBs may be supported at one end by a common backplate in a cantilevered manner, with the linear arrays of antenna elements located near the free end of the PCBs. The PCBs may include a thicker portion and a thinner portion, and the thinner portion may include a heat sink or other thermal dissipation structure.