Provided are wavelength based V2X antennas, and related antenna systems and method, which can include a first antenna having a first wavelength and a second antenna having a second antenna. Some antenna systems control a wavelength of a signal for transmission using one of the first antenna and the second antenna.

Disclosed is a system, method, mobile communication device and one or more computer programs for a monitoring system. In one aspect, the system includes a plurality of transmitters, each transmitter having associated therewith a reflector antenna configured to substantially reflect signal transmission toward a detection area; and a mobile device configured to: receive transmitter signals from at least two transmitters from the plurality of transmitters; and determine that the mobile device is located within the detection area based on received signal strengths of the at least some of the transmitter signals.

A multiband radiating array according to the present invention includes a vertical column of lower band dipole elements and a vertical column of higher band dipole elements. The lower band dipole elements operate at a lower operational frequency band, and the lower band dipole elements have dipole arms that combine to be about one half of a wavelength of the lower operational frequency band midpoint frequency. The higher band dipole elements operate at a higher frequency band, and the higher band dipole elements have dipole arms that combine to be about three quarters of a wavelength of the higher operational frequency band midpoint frequency. The higher band radiating elements are supported above a reflector by higher band feed boards. A combination of the higher band feed boards and higher band dipole arms do not resonate in the lower operational frequency band.

A multiband radiating array according to the present invention includes a vertical column of lower band dipole elements and a vertical column of higher band dipole elements. The lower band dipole elements operate at a lower operational frequency band, and the lower band dipole elements have dipole arms that combine to be about one half of a wavelength of the lower operational frequency band midpoint frequency. The higher band dipole elements operate at a higher frequency band, and the higher band dipole elements have dipole arms that combine to be about three quarters of a wavelength of the higher operational frequency band midpoint frequency. The higher band radiating elements are supported above a reflector by higher band feed boards. A combination of the higher band feed boards and higher band dipole arms do not resonate in the lower operational frequency band.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A balance antenna is disclosed herein. The balanced antenna comprises a first planar conductor layer forming an first infinite balun, a second planar conductor layer forming a second infinite balun, and a feeding gap. A cable transports a radio signal from the antenna to a radio and from a radio to the antenna. The first infinite balun and the second infinite balun transform an unbalanced transmission line characteristic of the cable to the balanced feeding of the antenna.

An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

The present invention relates to an omnidirectional antenna for a mobile communication service, comprising: a plurality of radiation elements disposed on a horizontal surface with a mutually same angle so as to respectively radiate beams; and a power supply unit for distributing and providing a power supply signal to each of the plurality of radiation elements, wherein each of the plurality of radiation elements has a structure in which a horizontal polarization dipole radiation unit having two radiation arms is coupled to a vertical polarization dipole radiation unit having two radiation arms.