A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

This invention relates to an antenna system comprising two identical mutually radiation coupled antennas arranged symmetrically with respect to one another, said antennas having a respective antenna connection gate and a network, which is connected at the input side to the antenna connection gates and which is formed from dummy elements, and having a respective antenna path to a network connection gate, said antenna paths being identical to one another and being separately associated with an antenna.

This invention relates to an antenna system comprising two identical mutually radiation coupled antennas arranged symmetrically with respect to one another, said antennas having a respective antenna connection gate and a network, which is connected at the input side to the antenna connection gates and which is formed from dummy elements, and having a respective antenna path to a network connection gate, said antenna paths being identical to one another and being separately associated with an antenna.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

Incoming calls are received from audio capable devices. A call processing server receives an incoming call from an audio-capable device to a destination number, and detects availability for an ancillary source device linked to the audio-capable device. A set of data is provided to the ancillary source device. The set of data specifies graphical menu options for functions supported by the call processing server. The ancillary source device provides an indication of a selection of one of the graphical menu options. In response to the indication, a call transfer for the incoming call is implemented.

A communications system is described which comprises a transmission unit including a transmission circuit 12 operable to output a transmission signal to a ground antenna 22 driven, in use, into a ground formation, and an impedance adjusting unit 20 electrically connected between the transmission circuit 12 and the antenna 22 and operable to adjust the transmission output impedance. A ground antenna 22 is also described comprising a single rod or stake including a first active section 30, a second active section 32 spaced apart from the first section 30 and collinear or coaxial therewith, and an insulating section 34 located between the first and second sections 30, 32, holding the first and second sections 30, 32 in a spaced, collinear or coaxial relationship.

Certain aspects of the present disclosure generally relate to wireless communication. In some aspects, an antenna module may include a substrate; a first dipole antenna positioned such that conductive components of the first dipole antenna are oriented on a first plane that is approximately parallel to a mounting surface of the substrate; and a second dipole antenna positioned such that conductive components of the second dipole antenna are oriented on a second plane that is approximately perpendicular to the mounting surface of the substrate, wherein the second dipole antenna is positioned to cover a broadside radiation pattern approximately perpendicular to the mounting surface. Numerous other aspects are provided.

Certain aspects of the present disclosure generally relate to wireless communication. In some aspects, an antenna module may include a substrate; a first dipole antenna positioned such that conductive components of the first dipole antenna are oriented on a first plane that is approximately parallel to a mounting surface of the substrate; and a second dipole antenna positioned such that conductive components of the second dipole antenna are oriented on a second plane that is approximately perpendicular to the mounting surface of the substrate, wherein the second dipole antenna is positioned to cover a broadside radiation pattern approximately perpendicular to the mounting surface. Numerous other aspects are provided.

Ultra wideband (UWB) antennas are provided including a printed circuit board; a radiating element coupled to the printed circuit board and substantially perpendicular thereto; and radio frequency (RF) electronics associated with the antenna integrated with the printed circuit board. Related enclosures and systems are also provided.