A multiband radiating array according to the present invention includes a vertical column of lower band dipole elements and a vertical column of higher band dipole elements. The lower band dipole elements operate at a lower operational frequency band, and the lower band dipole elements have dipole arms that combine to be about one half of a wavelength of the lower operational frequency band midpoint frequency. The higher band dipole elements operate at a higher frequency band, and the higher band dipole elements have dipole arms that combine to be about three quarters of a wavelength of the higher operational frequency band midpoint frequency. The higher band radiating elements are supported above a reflector by higher band feed boards. A combination of the higher band feed boards and higher band dipole arms do not resonate in the lower operational frequency band.

An antenna apparatus may be disclosed. The antenna apparatus may include a feed network including a plurality of first internal transmission lines arranged in a cross form and a plurality of second internal transmission lines arranged in a ring form around the plurality of first internal transmission lines; and a plurality of radiation elements positioned around the feed network and radiating signals fed by the feed network.

An antenna apparatus may be disclosed. The antenna apparatus may include a feed network including a plurality of first internal transmission lines arranged in a cross form and a plurality of second internal transmission lines arranged in a ring form around the plurality of first internal transmission lines; and a plurality of radiation elements positioned around the feed network and radiating signals fed by the feed network.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A surface wave launcher surrounds and provides structure complimentary to an antenna and converts (transforms) a near field produced by the antenna into a cylindrical surface wave structure with a strong electric or magnetic field component parallel to a launching interface and propagating two-dimensionally from the launcher. The surface wave launcher leverages the interface found along ocean-air or ground-air to increase a field strength transmitted for a given antenna size and power available. The surface wave launcher maintains a relatively small structure compared to wavelength offering mobility to a very low frequency transmitter. Due to localization of the surface wave energy near the interface, communications using the surface wave retain a desirable low probability of detection.

An antenna module and an electronic device are provided. The antenna module includes: a substrate, including a floor, a first dielectric layer, and a second dielectric layer, where the first dielectric layer and the second dielectric layer are located on two sides of the floor, respectively; a millimeter wave antenna array, including N dipole antenna units, where the N dipole antenna units are successively disposed in the substrate at an interval along the substrate, and N is an integer greater than 1; a radio frequency integrated circuit, where the radio frequency integrated circuit is disposed on the first dielectric layer and is connected to feeding structures of the N dipole antenna units; and a non-millimeter wave antenna, where the non-millimeter wave antenna is disposed on the second dielectric layer.

An antenna module and an electronic device are provided. The antenna module includes: a substrate, including a floor, a first dielectric layer, and a second dielectric layer, where the first dielectric layer and the second dielectric layer are located on two sides of the floor, respectively; a millimeter wave antenna array, including N dipole antenna units, where the N dipole antenna units are successively disposed in the substrate at an interval along the substrate, and N is an integer greater than 1; a radio frequency integrated circuit, where the radio frequency integrated circuit is disposed on the first dielectric layer and is connected to feeding structures of the N dipole antenna units; and a non-millimeter wave antenna, where the non-millimeter wave antenna is disposed on the second dielectric layer.

Ultra-wideband (UWB) antennas are provided including a printed circuit board; a radiating element coupled to the printed circuit board and substantially perpendicular thereto; and radio frequency (RF) electronics associated with the antenna integrated with the printed circuit board. Related enclosures and systems are also provided.

A device adapted for attachment to a coupler of a trailing railcar of a train includes an enclosure defining an internal compartment, a port adapted for connection to an air brake hose receiving air from a brake pipe of the train, a handle extending from the enclosure, a communication device disposed within the internal compartment of the enclosure, and at least one antenna connected to the communication device and extending at least partially through the internal compartment of the enclosure and into an internal cavity of the handle.