A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die has an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die has an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

Provided are examples of removable circularly polarized antenna fitment and methods of fabrication. In one aspect, a fitment comprises a plurality of conductive elements spaced radially around a central point contained with a housing. The elements may have an included angle of between 8 and 71 degrees from horizontal. The plurality of conducting elements may be straight, bent, or curved and may be comprised of between 3 and 12 conductors. The fitment may contain a housing which is removable from a linear antenna.

Provided are examples of removable circularly polarized antenna fitment and methods of fabrication. In one aspect, a fitment comprises a plurality of conductive elements spaced radially around a central point contained with a housing. The elements may have an included angle of between 8 and 71 degrees from horizontal. The plurality of conducting elements may be straight, bent, or curved and may be comprised of between 3 and 12 conductors. The fitment may contain a housing which is removable from a linear antenna.

The invention relates to an antenna structure for transmitting and/or receiving wavelengths of metric frequency or decimetric frequency, characterised in that it comprises n collinear antennas, each antenna comprising a radiating portion comprising a first succession of i coaxial radiating elements about a first axis alternating with at least an additional succession of i radiating elements about another axis, each antenna being independently powered by a coaxial cable, each antenna comprising at least one lower quarter-wave trap and at least one upper quarter-wave trap, at least a first antenna comprising at least one hollow core being configured to receive a coaxial cable intended for powering of another antenna collinear with the first antenna, at least one intermediate quarter-wave trap being arranged between two consecutive collinear antennas around a coaxial cable, and a terminal element.

An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

A multiband radiating array according to the present invention includes a vertical column of lower band dipole elements and a vertical column of higher band dipole elements. The lower band dipole elements operate at a lower operational frequency band, and the lower band dipole elements have dipole arms that combine to be about one half of a wavelength of the lower operational frequency band midpoint frequency. The higher band dipole elements operate at a higher frequency band, and the higher band dipole elements have dipole arms that combine to be about three quarters of a wavelength of the higher operational frequency band midpoint frequency. The higher band radiating elements are supported above a reflector by higher band feed boards. A combination of the higher band feed boards and higher band dipole arms do not resonate in the lower operational frequency band.

A multiband radiating array according to the present invention includes a vertical column of lower band dipole elements and a vertical column of higher band dipole elements. The lower band dipole elements operate at a lower operational frequency band, and the lower band dipole elements have dipole arms that combine to be about one half of a wavelength of the lower operational frequency band midpoint frequency. The higher band dipole elements operate at a higher frequency band, and the higher band dipole elements have dipole arms that combine to be about three quarters of a wavelength of the higher operational frequency band midpoint frequency. The higher band radiating elements are supported above a reflector by higher band feed boards. A combination of the higher band feed boards and higher band dipole arms do not resonate in the lower operational frequency band.

An array antenna is provided with: a first conductive member including a planar part; plural antennas arranged at a predetermined first interval to the planar part of the first conductive member, each of the plural antennas transmitting and receiving radio frequencies of a first polarization and radio frequencies of a second polarization that is different from the first polarization; and a second conductive member provided between the antennas adjacent to each other among the plural antennas via a gap of a predetermined second interval to the planar part of the first conductive member, the second conductive member being capacitively coupled to the first conductive member.