A method for designing a phased-array antenna embedded into stacked high impedance surfaces (HIS) structure is proposed. The stacked HIS structure comprises a plurality of HIS cell, which has two plate layers with adjustable height of the lower layer. Each HIS cell has a corresponding LC tank structure. Under a given height (HIS cell volume), the overall capacitance increases when the height of the lower layer plate increases. By adjusting the height of the lower layer plate, a variable capacitance of the corresponding LC tank can be achieved to allow lower operation frequencies of the phased-array antenna and to realize the benefit of HIS in band of interest. In addition, different design conditions can be achieved for the phased-array antenna.

The disclosure relates to structures of, and methods for forming electromagnetic band gap (EBG) element. Specifically, the disclosure is directed to methods for additively manufacturing electronic mushroom-type EBG elements having a periodic cell structure enabling a reduced footprint and increased band gap range for a very wide range of frequencies, for example between 500 MHz to about 30 GHz, by altering both the EBG structure's superstrate as well as the ground plane.

An antenna device includes at least one antenna conductor, at least one ground conductor, and an artificial magnetic conductor that is located between the at least one antenna conductor and the at least one ground conductor and is disposed separately from the at least one antenna conductor and the at least one ground conductor. At least one of the artificial magnetic conductor and the at least one ground conductor includes at least one opening formed at a place substantially facing a distal-side end of the at least one antenna conductor, the distal-side end of the at least one antenna conductor being opposite a feeder-side end of the at least one antenna conductor.

A resonant structure includes a conducting portion extending along a first plane and including first conductors, a ground conductor located away from the conducting portion and extending along the first plane, and a first predetermined number of connecting conductors extending from the ground conductor towards the conducting portion. At least two first conductors are connected to different connecting conductors. A first connecting pair of two of the connecting conductors is aligned along a first direction in the first plane and a second connecting pair of two of the connecting conductors is aligned along a second direction, in the first plane, intersecting the first direction. The resonant structure resonates at a first frequency along a first current path including the ground conductor, conducting portion, and first connecting pair and at a second frequency along a second current path including the ground conductor, conducting portion, and second connecting pair.

In one or more embodiments, a method of manufacturing a high impedance surface (HIS) apparatus comprises patterning a first conducting layer on a core to form a first set of conducting pads, and patterning a second conducting layer on the core to form a second set of conducting pads. The method further comprises applying solder paste to each of the conducting pads of the second set of conducting pads. Also, the method comprises placing chip capacitors on the solder paste on the second set of conducting pads. In addition, the method comprises applying underfill between the chip capacitors. Also, the method comprises applying solder paste to each of the conducting pads of the first set of conducting pads. In addition, the method comprises placing chip inductors on the solder paste on the first set of conducting pads. Further, the method comprises applying underfill between the chip inductors.

An antenna apparatus includes a ground pattern having a through-hole; an antenna pattern disposed above the ground pattern and configured to either one or both of transmit and receive a radio-frequency (RF) signal; a feed via penetrating through the through-hole and having one end electrically connected to the antenna pattern; and a meta member comprising a plurality of cells repeatedly arranged and spaced apart from each other, each of the plurality of cells comprising a plurality of conductive patterns, and at least one conductive via electrically connecting the plurality of conductive patterns to each other, wherein the meta member is disposed along at least portions of side boundaries of the antenna pattern above the ground pattern, and extends above the antenna pattern.

In one or more embodiments, a high impedance surface (HIS) apparatus comprises a core; a first set of conducting pads, where a first side of the first set of conducting pads is connected to a first side of the core; and a second set of conducting pads, where a first side of the second set of conducting pads is connected to a second side of the core. The apparatus further comprises a plurality of chip inductors, where at least a portion of the chip inductors are connected to a second side of the first set of conducting pads; and a plurality of chip capacitors, where at least a portion of the chip capacitors are connected to a second side of the second set of conducting pads.

A resonant structure includes a conducting portion extending along a first plane and including first conductors, a ground conductor located away from the conducting portion and extending along the first plane, and a first predetermined number of connecting conductors extending from the ground conductor towards the conducting portion. At least two first conductors are connected to different connecting conductors. A first connecting pair of two of the connecting conductors is aligned along a first direction in the first plane and a second connecting pair of two of the connecting conductors is aligned along a second direction, in the first plane, intersecting the first direction. The resonant structure resonates at a first frequency along a first current path including the ground conductor, conducting portion, and first connecting pair and at a second frequency along a second current path including the ground conductor, conducting portion, and second connecting pair.

A system and method for a dual-polarized active artificial magnetic conductor (AAMC) is presented in this disclosure. An embodiment of the proposed system comprises an array of unit cells that reflects electromagnetic waves polarized parallel to a surface with a zero-degree phase shift. The array of unit cells has impedance elements connected to neighboring impedance elements with non-Foster circuits coupled in a crossover configuration, each impedance element being coupled to a ground with a conductive via.

An antenna apparatus includes a ground pattern having a through-hole; an antenna pattern disposed above the ground pattern and configured to either one or both of transmit and receive a radio-frequency (RF) signal; a feed via penetrating through the through-hole and having one end electrically connected to the antenna pattern; and a meta member comprising a plurality of cells repeatedly arranged and spaced apart from each other, each of the plurality of cells comprising a plurality of conductive patterns, and at least one conductive via electrically connecting the plurality of conductive patterns to each other, wherein the meta member is disposed along at least portions of side boundaries of the antenna pattern above the ground pattern, and extends above the antenna pattern.