Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

The present invention relates to a parabolic antenna having a base, mounting pole head unit, rear structure, support pole, low noise converter, and reflector, said reflector being made in a single piece in laminated expanded screen, and having a perfectly parabolic, self-structured shape without any bearing frame, fastened to the rear structure of the parabolic antenna by means of a fastening unit, and having a reinforcement edge facing away from the concavity of the reflector, and rolled or in one or two levels in the peripheral region of the reflector, said reflector having one or more non-perforated or smooth sections, in arbitrary vertical, and/or horizontal orientations, extending over the fastening unit.

A method is provided which includes: defining at least one radiofrequency performance objective to be produced on a selected coverage area on the ground; producing a rigid shell having a predefined profile; producing a reflecting flexible membrane; determining, by successive iterations, N optimum local deformations to be applied at N different points of the flexible membrane; producing N rigid supporting bars of different lengths corresponding to the optimum local deformations to be applied to the flexible membrane; and positioning and rigidly fixing the flexible membrane onto the rigid shell via the N supporting bars.

Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

An electromagnetic wave reflector includes a panel having a reflective surface that reflects a radio wave of a frequency band selected from 1 GHz to 170 GHz, and a support body that supports the panel. The support body has a connector part electrically connected to the reflective surface, the connector part being configured to propagate a reference potential of a reflection having occurred at the reflective surface.

The propagation of radio waves in indoor and outdoor mobile communications is improved. An electromagnetic wave reflector includes: a panel having a reflecting surface and configured to reflect a radio wave of a desired band selected from frequency bands ranging from 1 GHz to 170 GHz; and a support supporting the panel, and, in this electromagnetic wave reflector, the support has a conductive frame and a non-conductive cover that covers at least part of the frame, and the frame has a slit and a hollow, the slit receiving an end part of the panel, and the hollow being independent of the slit.

An electromagnetic wave reflector includes a panel having a reflective surface that reflects a radio wave of a frequency band selected from 1 GHz to 170 GHz, and a support body that supports the panel, The support body has a connector part electrically connected to the reflective surface, the connector part being configured to propagate a reference potential of a reflection having occurred at the reflective surface.

A horn antenna device is disclosed that comprises: a plastic body comprising a top face, a bottom face opposing the top face and lateral faces adjoining the top face and the bottom face; and a cavity formed in the plastic body, wherein the cavity comprises a cavity opening formed at the top face of the plastic body, wherein the cavity is at least partially coated with a metal layer to form a horn antenna for radiating microwaves through the cavity opening, wherein the plastic body is partially coated with the metal layer, and wherein the metal layer being configured to define a radiation characteristic of the horn antenna.

A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.

A deployable spacecraft element which has a solar energy collection and conversion means on one side of the deployable element and a radio frequency reflecting means on the other side of the deployable element. While the solar collection and conversion means and the radio frequency reflecting means are nominally oriented in opposite spatial directions and dependent on the orientation of the spacecraft to orient for solar collection or radio frequency transmission, one or more deployable elements may be mounted to a gimbal to allow for simultaneous solar collection and radio frequency collection by the spacecraft.