An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

A twin beam base station antenna includes a first array that has a plurality of columns of first frequency band radiating elements, the first array configured to form a first antenna beam that provides coverage throughout a first sub-sector of a three-sector base station. The radiating elements in a first of the columns in the first array have a first azimuth boresight pointing direction and the radiating elements in a second of the columns in the first array have a second azimuth boresight pointing direction that is offset from the first azimuth boresight pointing direction by at least 10°. The radiating elements in the second of the columns in the first array are electrically steered.

A method for transmitting signals using a high frequency based integrated circuit beamforming antenna is disclosed. The method may comprise transferring an output signal of a radio frequency (RF) module to an RF transceiving unit; transferring an output signal of the RF transceiving unit to a signal converting unit including a feeding pillar; and transferring a wave signal from the signal converting unit to a traveling wave antenna unit, and the feeding pillar may convert the output signal of the RF transceiving unit to the wave signal.

An antenna array may include a plurality of printed circuit boards (PCBs) oriented in a stacked arrangement, parallel to and spaced apart from one another. Each of the PCBs may include a linear array of antenna elements, which cooperate with the linear arrays of antenna elements on other PCBs to form a two-dimensional array of antenna elements. The PCBs may be supported at one end by a common backplate in a cantilevered manner, with the linear arrays of antenna elements located near the free end of the PCBs. The PCBs may include a thicker portion and a thinner portion, and the thinner portion may include a heat sink or other thermal dissipation structure.

Radiating elements of first and second linear arrays of radiating elements have respective feed stalks that can reside at an angle to provide a balanced dipole arm with an inner end portion laterally offset to be closer to a right or left side of the base station antenna and reflector than an outer end portion that faces a radome of the base station antenna. The feed stalk can include sheet metal legs and printed circuit boards providing an RF transmission line(s).

An electronic device may include an antenna that conveys wireless signals at frequencies greater than 100 GHz. The antenna may include a radiating element coupled to a uni-travelling-carrier photodiode (UTC PD). An optical path may illuminate the UTC PD using a first optical local oscillator (LO) signal and a second optical LO signal. An optical phase shift may be applied to the first optical LO signal. A Mach-Zehnder modulator (MZM) may be interposed on the optical path. During signal transmission, the MZM may modulate wireless data onto the second optical LO signal while control circuitry applies a first bias voltage to the UTC PD. During signal reception, the control circuitry may apply a second bias voltage to the UTC PD that configures the UTC PD to convert received wireless signals into intermediate frequency signals and/or optical signals.

An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.

An electronic device including an antenna and a conductive pattern formed around the antenna is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a conductive material, an injection-molding material disposed in the space between the first plate and the second plate in the housing and formed of a non-conductive material, an antenna module including conductive radiators and supported by the injection-molding material, and a conductive pattern disposed on a first surface adjacent to the second plate of the injection-molding material or disposed inside the injection-molding material and disposed adjacent to a part of an edge of the antenna module corresponding to a boundary between the antenna module and the injection-molding material when viewed from the second plate in a direction of the first plate. A partial conductive radiator of the conductive radiators may be disposed to transmit and/or receive a signal through the second plate.

A MIMO communication system is provided. The system may include a first antenna comprising a first cavity, a first plurality of RF ports for generating a feed wave within the first cavity, and a first plurality of sub-wavelength artificially structured material elements as arranged on a surface of the first cavity as RF radiators. The first antenna is configured to generate a plurality of radiation patterns respectively corresponding to the first plurality of ports. The system may also include a second antenna comprising a second cavity and a second plurality of sub-wavelength artificially structured material elements arranged on a surface of the second cavity.

An antenna that enables dense packing of radiators includes a plurality of first radiators configured to radiate in a first frequency band and a plurality of second radiators configured to radiate in a second frequency band, the second frequency band having higher frequencies than the first frequency band. each of the plurality of first radiators includes a plurality of dipole arms. Each of the plurality of dipole arms includes a periodic pattern of inductive choke segments, and each of the dipole arms has a broken peripheral current path.