Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

A low profile dual-frequency antenna device comprises an insulative carrier having a first surface and a second surface which are opposite and a conductor unit, the conductor unit comprises a first conductor which is provided to the first surface and a second conductor which is provided to the second surface and connected with the first conductor, a first radiation slot as a low frequency slot antenna is formed between the first conductor and the second conductor, the first conductor is formed with a second radiation slot, a third radiation slot which is communicated with the first radiation slot and the second radiation slot, a fourth radiation slot and a fifth radiation slot, and the third radiation slot, the fourth radiation slot and the fifth radiation slot together constitute a high frequency slot antenna, the second radiation slot decides an impedance and a resonance frequency width of each antenna, a first side edge and a second side edge is oppositely positioned at a location where the second radiation slot and the third radiation slot are communicated, the first conductor has a signal feeding-in portion thereon close to the first side edge, the first conductor has a ground portion thereon close to the second side edge.

Examples disclosed herein relate to a multi-layer, multi-steering (MLMS) antenna array for autonomous vehicles. The MLMS antenna array includes a superelement antenna array layer comprising superelement subarrays, in which each superelement subarray includes radiating slots for radiating a transmission signal. The MLMS antenna array also includes a power divider layer coupled to the superelement antenna array layer and configured to serve as a feed to the superelement antenna array layer, in which the power divider layer is coupled to phase shifters that apply different phase shifts to transmission signals propagating to the superelement antenna array layer. The MLMS antenna array also includes a transition layer configured to couple the power divider layer and the superelement antenna array layer to the phase shifters through transition structures such as through-hole vias. Other examples disclosed herein include a radar system for use in an autonomous driving vehicle.

The present disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4.sup.th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.

The present disclosure relates to a plug-in antenna device arranged to be received in a waveguide section. The plug-in antenna device includes one or more dielectric elements arranged in series and spaced apart by connecting members, a top-most dielectric element being arranged as antenna element. When the plug-in antenna device is received in the waveguide section, the dielectric elements are arranged electromagnetically coupled, whereby a radio frequency signal included in a radio frequency band passing to or from the antenna element via the dielectric elements is arranged to be electromagnetically filtered.

According to an example aspect of the present invention, there is provided an antenna array for a transmit-array antenna system with a fixed feed antenna, comprising an inner radiating surface for receiving a first signal from the fixed feed antenna, an outer radiating surface for emitting a second signal from the antenna array and a platform for electric connection of Radio Frequency, RF, components disposed between the inner and outer radiating surfaces, the platform having a phase shifter for operatively connecting the inner and outer radiating surfaces.

A multibeam antenna is provided comprising a direct radiating array, DRA, and a reflector arranged to reflect signals radiated from the DRA in a transmission mode and to reflect signals to the DRA in a reception mode. The antenna is a very high throughput satellite (VHTS) antenna providing global coverage with narrow, high gain beams.

The present invention minimizes the overall area occupied by a reception antenna while preventing erroneous detections resulting from azimuth aliasing. A reception antenna includes antenna elements that are disposed along the horizontal direction, antenna elements that are disposed along the vertical direction, and an antenna element that is disposed at an angle from the antenna elements with respect to the horizontal direction and is disposed at an angle from the antenna elements with respect to the vertical direction. The distance between the centers of the antenna elements in the horizontal direction differs from the distances between the center of the antenna element and the respective centers of the antenna elements in the horizontal direction. The distance between the centers of the antenna elements in the vertical direction differs from the distances between the center of the antenna element and the respective centers of the antenna elements in the vertical direction.

Antennas and methods for using the same are described. In one embodiment, the antenna comprises an aperture having a plurality of radio-frequency (RF) radiating antenna elements, the plurality of RF radiating antenna elements being grouped into three or more sets of RF radiating antenna elements, with each set being separately controlled to generate a beam at a frequency band in a first mode.

The invention relates to a heatsink antenna array structure, which includes a fin-shaped metal heatsink, a metal bottom base of heatsink, and a substrate. The upper surface of substrate is connected with the metal bottom base of heatsink, the lower surface is connected with a chip. The chip works as heat source. There is a rectangular through-cavity array in the bottom base as radiation aperture. The substrate contains multiple metal layers and dielectric layers. The top metal layer has rectangular apertures corresponding to the rectangular through-cavity array in the bottom base. The dielectric layers contain metallic vias to construct a substrate integrated waveguide structure. The metallic vias effectively reduce the thermal resistance between the fin-shaped metal heatsink and the chip, and form the substrate integrated waveguide structure as the feeding network of heatsink antenna array. Compared with the prior arts, the present invention realizes a conformal structure of antenna and heatsink, which improves the integration level of system.