An electronic device may include communications circuitry, sensing circuitry, and a set of antennas having first and second feeds for covering different polarizations. The communications circuitry may transmit signals with a first polarization using each of the antennas and may concurrently transmit signals with a second polarization using all but a selected one of the antennas. The sensing circuitry may concurrently transmit sensing signals with the first polarization using one of the antennas and may receive sensing signals with the second polarization using the selected antenna. The sensing signals may include chirp signals generated to include muted periods that correspond to a range of frequencies that overlap frequencies at which the wireless circuitry is subject to radio-frequency interference. This may allow for concurrent wireless communications and sensing operations without interference between the communications circuitry and the sensing circuitry.

A communications apparatus to be installed on high mast lighting systems or other vertical assets with significant above ground projections. The apparatus is designed to mount to existing light ring spokes or other existing mounting structures. The system is powered during nighttime hours by grid power and during daylight hours by internal battery storage. A uniquely-oriented directional dual polarity MIMO antenna adapted for high mast mounting supports communications with mobile vehicles using MIMO emissions in a North/South and East/West polarization. Mobile vehicle clients may then use dual polarized antennas including skyward-looking radiation patterns with major lobes that are oriented directly up towards the sky.

The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz. The apparatus (200) comprises: a plurality of sub-arrays (208) together configured to form a phased array antenna, each sub-array (208) comprising at least four antenna elements (220), each antenna element (220) for receiving an input signal from the sub-array (220) and comprising: an antenna (230) for transmission of the input signal; and a signal modification component (222) to adjust a phase of the input signal during propagation to the antenna (230); and a plurality of power amplifiers (212), wherein each sub-array (208) is provided with a one of the plurality of power amplifiers (212), wherein each sub-array (208) is arranged to be provided with an amplified input signal, and each antenna element (220) of the sub-array (208) is configured to be provided with the amplified input signal of the respective sub-array (208) as the input signal to the antenna element (220), and wherein the power amplifier (212) for each sub-array (208) is configured to receive a phased array input signal for amplification and to output the respective amplified input signal to the respective sub-array (208). The power amplifier (212) for each sub-array (208) may be physically separate and distinct from each sub-array (208).

Provided is an electronic device having an antenna according to an embodiment. The electronic device may comprise a first and a second ground plane arranged on different layers of a multi-layer substrate and configured to be connected to each other through vias spaced a predetermined distance apart from each other. The electronic device may comprise a signal line arranged on the same plane as the first ground plane which is disposed at the upper side among the first and the second ground plane. The electronic device may comprise a radiator configured to be electrically connected to the signal line and emit a signal. The first ground plane may be disposed at only one region of one side region and the other side region of the signal line in a predetermined section.

A semiconductor package having a thinner shape and including an antenna is provided. A semiconductor package comprises a first substrate, a second substrate on the first substrate and including a first face facing the first substrate and a second face opposite to the first face, a pillar extending from the second face of the second substrate to the first substrate, and a first semiconductor chip on the second face of the second substrate and connected to the pillar. The second substrate may include an antenna pattern, and the antenna pattern may be connected to the first semiconductor chip, and may be on the second face of the second substrate such that the antenna pattern is isolated from direct contact with the first semiconductor chip.

An antenna device according to an aspect includes a dielectric layer, a radiator formed on the dielectric layer, and a transmission line connected to the radiator on the dielectric layer and formed in a mesh structure which is a set of unit cells defined by a plurality of conductive lines. A width of the transmission line may be an integer multiple of the width of the unit cell, and may be within an allowable error range.

In an antenna element, a planar ground conductor layer on an insulation substrate is connected to ground. A radiation conductor layer radiates and/or receives high-frequency signals. The radiation conductor layer is in or on the insulation substrate and above the planar ground conductor layer. A lower principal surface of the radiation conductor layer overlaps an upper principal surface of the planar ground conductor layer as viewed in an up-down direction. The ground conductor is in the insulation substrate and connected to the ground potential. An upper end of the ground conductor is above the radiation conductor layer. The ground conductor layer is spaced away from the radiation conductor layer as viewed in the up-down direction. Only a conductor through which the high-frequency signals are transmitted and a conductor connected to the ground potential are between the ground conductor and the radiation conductor layer.

The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). An antenna module is provided. The antenna module includes multiple antennas, a distribution circuit disposed to provide an electrical connection with each of the multiple antennas, a metal plate, and a dielectric substrate disposed between a pattern layer of the distribution circuit and the metal plate, wherein the dielectric substrate includes one or more dielectric film layers and one or more adhesive layers.

A 5th Generation (5G) or pre-5G communication system for supporting a data transfer rate higher than that of a post-4th Generation (4G) communication system such as Long Term Evolution (LTE) is provided. The radio unit (RU) device includes a first printed circuit board (PCB) on which a plurality of antenna elements are disposed, a second PCB on which a radio frequency integrated circuit (RFIC) is disposed, and a third PCB configured to electrically connect each of the plurality of antenna elements and the RFIC between the first PCB and the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.