A phased array antenna includes multiple antenna elements where each antenna element is an antenna apparatus that includes an antenna integrated with a filter. Each antenna apparatus includes a plurality of resonators where at least some of the resonators are each enclosed in a metal cavity and at least one resonator is exposed to free space to form a radiator element. Each antenna apparatus has a filter transfer function that is at least partially determined by dimensions of the radiator element and the position of the radiator element within the antenna apparatus. The scan volume of the phased array antenna is dependent on at least one physical dimension of the filter of the antenna apparatus.

An antenna module includes a control board having a control circuit, an antenna board on the control board and having a shield through hole and a plurality of first antenna patch conductors, a signal conductor on the control board and the antenna board, a frame body surrounding the first antenna patch conductors and separating the first antenna patch conductors from each other, a metal film covering at least an outer surface or an inner surface of the frame body, and a filter electrically connected to the shield through hole. The control or antenna board includes an internal antenna opposing the first antenna patch conductors. When seen in a plan view, the shield through hole is located between the first antenna patch conductors. A resin having a higher dielectric constant than air is located is surrounded by the frame body such that the first antenna patch conductors are coated with resin.

An antenna structure, a circuit board with an antenna structure, and a communications device. The antenna structure includes a signal reference ground, a first radiation patch, a second radiation patch, and at least one feed probe. The feed probe is located between the first radiation patch and the ground. Each feed probe includes a first end and a second end. A projection position of the first end on a plane of the signal reference ground is outside a projection area of the first radiation patch on the plane of the signal reference ground is located, and a projection position of the second end on the plane of the signal reference ground is inside the projection area of the first radiation patch on the plane of the signal reference ground. The second end is electrically connected to the signal reference ground.

An onboard antenna, a radio equipment and an electronic device. The onboard antenna includes a dielectric substrate, an antenna and a metal block, wherein the antenna is located on the dielectric substrate, a projection of the metal block on a plane where the dielectric substrate is located is not overlapped with a projection of the antenna on the plane where the dielectric substrate is located, the metal block is located on the dielectric substrate in a polarization direction of the antenna, and a distance between a metal edge of the metal block on a side close to the antenna and the antenna is greater than a coupling threshold. Using this onboard antenna, an influence of surface waves on the pattern can be suppressed to a certain extent by arranging the metal block, and a jitter of the antenna pattern can be reduced.

An antenna device according to an embodiment includes an array antenna including a plurality of antenna elements, a first flexible printed circuit board (FPCB) including a plurality of first transmission lines which are electrically connected to the plurality of antenna elements and have different lengths, and a radio frequency integrated circuit (RFIC) electrically connected to the plurality of first transmission lines.

This application provides a lens antenna, a detection apparatus, and a communications apparatus. The lens antenna includes a feed source, a radio frequency switch, at least two narrow beam radiation units, and a wide beam radiation unit. The feed source may selectively feed any narrow beam radiation unit or the wide beam radiation unit by using the radio frequency switch.

The narrow beam radiation unit or the wide beam radiation unit may be connected to the feed source by switching of the radio frequency switch. A first radiation region of the wide beam radiation unit covers a second radiation region of each narrow beam radiation unit. The wide beam radiation unit includes a plurality of radiation sub-units, and the plurality of radiation sub-units are connected to the radio frequency switch by using a power splitter. In this way, radiation of the plurality of radiation sub-units forms a wide beam.

An antenna module includes a dielectric substrate, in or on which a feed element is formed, a dielectric substrate, in which a ground electrode (GND) is formed, and conductive members. The dielectric substrate is disposed opposite the dielectric substrate. When viewed in plan in the direction normal to the feed element, the conductive members are disposed around the feed element. An air layer is formed between the dielectric substrate and the dielectric substrate. The conductive members are formed in the air layer.

A liquid crystal antenna is provided. The liquid crystal antenna includes a first substrate, a second substrate, a liquid crystal layer, a plurality of transmission electrodes including a first transmission electrode and a second transmission electrode, a plurality of signal lines including a first signal line and a second signal line, a plurality of signal terminals including a first signal terminal and a second signal terminal, and a ground electrode. A transmission electrode is electrically connected to a signal terminal through at least one signal line. The first transmission electrode is connected to the first signal terminal through the first signal line, and the second transmission electrode is connected to the second signal terminal through the second signal line. A resistance of the first signal line is A, and a resistance of the second signal line is B, where A/B is less than 10.

Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.

An apparatus is provided that includes a set of antenna elements and switching nodes. Each switching node has physical interconnects to a sub-set of the antenna elements for transferring communication signals and the switching nodes have physical interconnects to other switching nodes forming a network of switching nodes for transferring communication signals between switching nodes. The apparatus also includes a controller for controlling operation of switching nodes to control use of the physical interconnects between switching nodes and control creation of different patterns of antenna elements operationally interconnected via multiple operationally interconnected switching nodes.