The present disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting higher data transmission rates than 4.sup.th generation (4G) communication systems such as Long-Term Evolution (LTE). According to one or more embodiments, an antenna includes: a first metal patch; a second metal patch; a feeding circuit; and a substrate. The first metal patch and the second metal patch are arranged on the substrate. The feeding circuit is coupled to the substrate and is spaced apart from the first metal patch.

The disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4.sup.th generation (4G) communication system such as long term evolution (LTE). An electronic device including an antenna in a wireless communication system is provided. The electronic device includes a radiator, a body, and a feeding circuit for transmitting a signal, wherein the radiator is coupled to at least a part of the body, the feeding circuit is coupled to the body to support the body, and the radiator is disposed to be spaced apart from the feeding circuit to form an air gap.

An array antenna includes a flexible substrate formed by stacked liquid crystal polymer (LCP) layers and has at least one feed point. At least one serial antenna is arranged on the flexible substrate, and a microstrip is extended from the feed point to connect a plurality of radiating elements in series to form the serial antenna. The tail end one of the radiating elements of the serial antenna is connected to one end of a ground microstrip, and another end of the ground microstrip is short-circuited to the ground. The length of the ground microstrip is approximately one fourth of the wavelength of the center frequency of the array antenna. Feeding sections where microstrips feeding to the radiating elements are in a horn and/or groove shape. Desired frequency and bandwidth may be obtained by adjusting lengths and widths of feeding sections respectively.

A switchable dual polarization patch antenna with improved cross polarization isolation to concurrently radiate horizontally polarized signals and vertically polarized signals. A planar conductor is arranged with a first terminal and a second terminal that are vertically spaced on a portion of the planar conductor to radiate a component of a vertically polarized signal with zero degrees of phase shift from one of the two terminals and radiate another component of the vertically polarized signal having a 180 degrees of phase shift from the other of the two terminals. A hybrid coupler can provide the 180 degrees of phase shift. A horizontally polarized signal is radiated from a third terminal that is horizontally spaced on another portion of the planar conductor and coupled to a horizontally polarized signal source. The direction of the 180 phase shift for the first and second components of the vertically polarized signal may be selected. Also, a direction for a phase shift for the horizontally polarized signal may be selectable.

A radar device for a vehicle, according to an embodiment of the present invention, comprises: a case; a first printed circuit board (PCB) that is accommodated in the case and has a plurality of antenna arrays and an integrated circuit (IC) chip that are formed thereon, wherein the IC chip is connected to the plurality of antenna arrays; and a radome that is coupled to the case and covers the first printed circuit board, wherein the radome includes: a cover facing the first printed circuit board; a first wall connected to the cover surface; and a second wall connected to the cover and facing the first wall, wherein the internal angle between the cover and the first wall and the internal angle between the cover and the second wall are formed to be greater than 90° and less than 180°.

A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.

A positioning unit of an access control and user tracking system includes an antenna, which is embedded in the substrate of a ceiling tile of a drop ceiling system. The antenna can be observable (embedded in the substrate of an exposed surface of the ceiling tile), or, alternately, not observable (concealed within the substrate of the ceiling tile). A pinhole camera for capturing video information is inserted through the substrate of the ceiling tile and protrudes from the exposed surface of the tile. A ground plane covers the unexposed surface of the ceiling tile. A control module, comprising a controller, a network interface, an antenna controller, a power supply, an omni directional antenna and/or memory for the positioning unit, is positioned on the unexposed surface of the tile.

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and an antenna element over the semiconductor die. The chip package also includes a first conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element. The chip package further includes a protective layer surrounding the first conductive feature. In addition, the chip package includes a second conductive feature over the first conductive feature. A portion of the second conductive feature is between the first conductive feature and the protective layer.

Systems, methods, and non-transitory media are provided for cross-coupling modeling and compensation. An example method can include determining one or more cross-coupling coefficients representing electrical cross-coupling within a component of a phased array antenna, wherein the component of the phased array antenna includes one or more signal paths between one or more beamformers of the phased array antenna and a set of antenna elements of the phased array antenna; based on the one or more cross-coupling coefficients, modifying one or more beamforming weights calculated for one or more signals routed via the one or more signal paths, wherein the modified one or more beamforming weights compensate for the electrical cross-coupling effect within the component of the phased array antenna; and applying, by the one or more beamformers, the modified one or more beamforming weights to the one or more signals routed via the one or more signal paths.

A system for transmitting and receiving wireless signals through a physical barrier, such as walls or windows, to wireless computing devices that are located internal to a structure that is formed in part by the physical barrier. The wireless signals are millimeter waveforms with gigahertz frequencies that are communicated with 5G communication protocols by one or more remote base station nodes located external to the physical barrier. One or more external antennas are configured to communicate RF wireless signals with HMA waveforms to remote wireless base station. In one or more embodiments, the RF wireless signals are amplified and communicated bi-statically through the window barrier between customer premises equipment and an authorized remote wireless base station.