H01Q21/065

Device package

An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Antenna module and communication apparatus
11705631 · 2023-07-18 · ·

An antenna module includes digital phase shifters, a plurality of antenna elements arranged in a first direction, and a fixed phase shifter. Each of the digital phase shifters changes a phase of a signal to a first phase value. The fixed phase shifter changes a phase of a signal to a second phase value, the second phase value being obtained by adding a predetermined offset phase value to the first phase value. A middle point of a virtual line is an antenna center and connects a center of an antenna element located on an end in the first direction and a center of an antenna element located on a different end. Under a symmetrical condition, an antenna center among the plurality of antenna elements are paired as an antenna element pair, the fixed phase shifter is electrically connected to at least one antenna element of the antenna element pair.

Electronic device
11705642 · 2023-07-18 · ·

An electronic device is provided. The electronic device includes a first antenna unit, a second antenna unit, and a feeding unit. The first antenna unit includes a first phase shifting structure, wherein the first phase shifting structure includes a first pattern. The second antenna unit includes a second phase shifting structure, wherein the second phase shifting structure includes a second pattern. The feeding unit is coupled to the first antenna unit and the second antenna unit, wherein the first pattern is different from the second pattern.

Antenna system including a polymer composition having a low dissipation factor
11705641 · 2023-07-18 · ·

A 5G antenna system is disclosed that comprises a substrate and at least one antenna element configured to transmit and receive 5G radio frequency signals. The at least one antenna element is coupled to the substrate. The substrate comprises a polymer composition that comprises a polymer matrix containing at least one polymer having a glass transition temperature of about 30° C. or more and at least one laser activatable additive wherein the polymer composition exhibits a dissipation factor of about 0.1 or less, as determined at a frequency of 2 GHz.

Antenna unit, antenna apparatus and electronic device

Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.

Single-layer wide angle impedance matching (WAIM)

A single-layer Wide Angle Impedance Matching (WAIM) and method for using the same are described. In one embodiment, the antenna comprises: an aperture having a plurality of antenna elements operable to radiating radio-frequency (RF) energy; and a single-layer wide angle impedance matching (WAIM) structure coupled to the aperture to provide impedance matching between the antenna aperture and free space.

Composite antenna unit and array antenna using the same

A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.

ANTENNA STRUCTURE, RADAR, AND TERMINAL
20230017270 · 2023-01-19 ·

An antenna structure, a radar, and a terminal may be applied to the field of millimeter-wave radars and can extend a 3 dB bandwidth of the antenna structure. The antenna structure includes: A main feeder and at least one patch unit group, where the at least one patch unit group is connected in series to the main feeder in a length direction of the main feeder, and each of the at least one patch unit group includes at least two patch units disposed in a V-shaped structure. Each patch unit group is connected in series to the main feeder through the two patch units that are disposed in the V-shaped structure and that are in each patch unit group.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
20230223364 · 2023-07-13 ·

A device includes a redistribution structure, a first semiconductor device, a first antenna, and a first conductive pillar on the redistribution structure that are electrically connected to the redistribution structure, an antenna structure over the first semiconductor device, wherein the antenna structure includes a second antenna that is different from the first antenna, wherein the antenna structure includes an external connection bonded to the first conductive pillar, and a molding material extending between the antenna structure and the redistribution structure, the molding material surrounding the first semiconductor device, the first antenna, the external connection, and the first conductive pillar.

ANTENNA ARRAY WITH INDEPENDENT RFIC CHIP AND ANTENNA ELEMENT LATTICE GEOMETRIES
20230223707 · 2023-07-13 ·

An antenna apparatus includes a first component layer having a plurality of RFICs arranged in a first lattice geometry (e.g., rectangular), where each RFIC comprises beamforming circuitry. A second, parallel component layer overlays the first component layer and includes a plurality of antenna elements arranged in a second, different lattice geometry (e.g., triangular). The antenna elements have respective feed points each coupled to an input/output (I/O) pad of an RFIC. Each I/O pad is aligned with the feed point coupled thereto along an axis orthogonal to the first and second layers.