An antenna module, comprising: a substrate; at least one first antenna array, located on the substrate, comprising at least one first antenna and having a first maximum radiation direction; and at least one second antenna array, located on the substrate, comprising at least one second antenna and having a second maximum radiation direction. A communication device using the antenna module is also disclosed.

According to various embodiments, an electronic device includes a housing including a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit. Various other embodiments are possible.

A radar apparatus includes an antenna composed of an end-fire array antenna and including a plurality of antenna elements; and a circuit board in which the plurality of antenna elements is disposed side by side in a first direction. At least one of the plurality of antenna elements is parallel to a substrate surface of the circuit board. A directivity of at least one of the plurality of antenna elements is set to a third direction tilted with respect to the first direction and a second direction orthogonal to the first direction.

An antenna array system and a method for making the antenna system. The system includes at least two antenna elements serving as transmitter elements, and at least two antenna elements serving as receiver elements. Each of the transmitter antenna and receiver antenna elements include a pair of curved arms, wherein a first arm in the pair of curved arms is configured to be connected from a signal trace of the antenna system. The second arm in the pair of curved arms is configured to be connected to a ground plane.

An electronic device including an antenna and a conductive pattern formed around the antenna is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a conductive material, an injection-molding material disposed in the space between the first plate and the second plate in the housing and formed of a non-conductive material, an antenna module including conductive radiators and supported by the injection-molding material, and a conductive pattern disposed on a first surface adjacent to the second plate of the injection-molding material or disposed inside the injection-molding material and disposed adjacent to a part of an edge of the antenna module corresponding to a boundary between the antenna module and the injection-molding material when viewed from the second plate in a direction of the first plate. A partial conductive radiator of the conductive radiators may be disposed to transmit and/or receive a signal through the second plate.

A system according to one embodiment includes a first antenna element configured to communicate a first signal, the first signal polarized in a first orientation; a second antenna element co-located with the first antenna element, the second antenna element configured to communicate a second signal, the second signal polarized in a second orientation, the second orientation orthogonal to the first orientation; and driver circuitry coupled to the first antenna element and the second antenna element, the driver circuitry configured to process the first signal and the second signal to achieve signal diversity in a wireless communication link.

An antenna module includes: an IC package including an IC; first and second antenna portions including respective patch antenna patterns, respective feed vias connected to the respective patch antenna patterns, and respective dielectric layers surrounding the respective feed vias; and a connection member having an upper surface on which the first and second antenna portions are disposed and a lower surface on which the IC package is disposed, the connection member forming an electrical connection path between the IC and the feed via of the first antenna portion and an electrical connection path of the second antenna portion. The connection member includes a first region disposed between the IC package and the first antenna portion, a second region on which the second antenna portion is disposed, and a third region electrically connecting the first and second regions and being more flexible than the dielectric layer of the first antenna portion.

A package structure includes a semiconductor die, an antenna substrate structure, and a redistribution layer. The semiconductor die is laterally wrapped by a first encapsulant. The antenna substrate structure is disposed over the semiconductor die, wherein the antenna substrate structure includes a circuit substrate and at least one antenna element inlaid in the circuit substrate. The redistribution layer is disposed between the semiconductor die and the antenna substrate structure, wherein the at least one antenna element is electrically connected with the semiconductor die through the circuit substrate and the redistribution layer. The at least one antenna element includes patch antennas.

Systems and methods for enhanced fault tolerance for a radio frequency identification (RFID) phased array antenna are provided. The systems include a RFID reader that includes (i) a phased array antenna having N antenna elements; and (ii) a controller operatively connected to the phased array antenna. The controller is configured to (1) monitor a characteristic for each antenna element of a set of the N antenna elements; (2) based on the characteristic, detect a fault of a faulty antenna element of the set of the N antenna elements; and (3) responsive to detecting the fault of the faulty antenna element of the set of the N antenna elements, adjust a parameter of at least one other antenna element of the N antenna elements, wherein the parameter is a weight applied to a signal that is transmitted to or received at an antenna element.

A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.