An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate. The active circuit includes a power management (PM) chip and a radio frequency (RF) chip coupled to a second package substrate coupled to the first package substrate.

An antenna assembly includes a substrate, an antenna radiator and a circuitous transmission line. In various embodiments, a novel antenna radiator, a circuitous transmission line, and assemblies thereof are disclosed. The embodiments provide an antenna module that is optimized for wide band 5GNR frequencies (ex: 600 MHz to 6000 MHz) using a combined feeder extension of a serpentine RF coaxial cable and planar transmission line.

An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate. The active circuit includes a power management (PM) chip and a radio frequency (RF) chip coupled to a second package substrate coupled to the first package substrate.

A combiner network is provided. The combiner network may include a combiner of a first type. The combiner network may further include a combiner of a second type. The combiner of a first type includes a first plurality of waveguide ports and an H-plane combiner connected to an E-plane combiner. The combiner of the second type includes a second plurality of waveguide ports and an H-plane combiner including a U-bend.

A dual-band shared-aperture antenna array based on a dual-mode parallel waveguide is applicable to the field of wireless communications technologies. The dual-band shared-aperture antenna array includes: a waveguide-substrate integrated waveguide transition structure, a multi-stage cascaded power splitter, a transverse coupling slot, a longitudinal coupling slot, a matching through-hole, a shared-aperture dual-mode parallel waveguide, and a shared-aperture parallel slot array. The entire structure includes two dielectric substrates. A signal is input to the multi-stage cascaded power splitter through the waveguide-substrate integrated waveguide transition structure located on a bottom-layer substrate. The foregoing dual-band shared-aperture antenna array based on a dual-mode parallel waveguide can separately implement a low-band fixed-beam slot array antenna, a high-band multi-beam long slot leaky-wave antenna, or a fixed-beam slot array antenna. It has a simple structure, multiple functions, high integration, a small size and light weight.

A combiner network is provided. A combiner network may include a corporate combiner. The corporate combiner may include a first plurality of radiation elements. The corporate combiner may include a first H-plane combiner connected to the first plurality of radiation elements and connected by a U-bend to a first E-plane combiner. The corporate combiner may include a second H-plane combiner connected to the first E-plane combiner. The corporate combiner may further include a first port. A plurality of corporate combiners may be assembled together as a combiner network.

An antenna array is provided that includes a plurality of radiating elements and one or more combiners. The plurality of radiating elements and the combiners are formed as a single indivisible metal element by use of additive manufacturing processes.

Techniques and mechanisms to transmit signals with an antenna array. In an embodiment, a first signal is received at a first input of the first antenna while a second signal is received at a second input of the second antenna. A difference in phase differentials—the phase differentials each between the first signal and the second signal—results from propagation of the first signal and the second signal in the antenna array and from a difference between respective configurations of the first antenna and the second antenna. Each of the first antenna and the second antenna has respective emitters distributed along the length thereof. In another embodiment, the first antenna and the second antenna have different respective dielectric structures or different respective distributions of emitters.

A combiner network is provided. A combiner network may include a corporate combiner. The corporate combiner may include a first plurality of radiation elements. The corporate combiner may include a first H-plane combiner connected to the first plurality of radiation elements and connected by a U-bend to a first E-plane combiner. The corporate combiner may include a second H-plane combiner connected to the first E-plane combiner. The corporate combiner may further include a first port. A plurality of corporate combiners may be assembled together as a combiner network.

An antenna assembly includes a first interface for receiving a first RF signal, a second interface for receiving a second RF signal, and an antenna array including a first array and a second array that extend vertically. The first array includes a first radiating element and a second radiating element, and the second array includes a third radiating element and a fourth radiating element. A power coupling circuit is provided, which is configured to feed a first sub-component of the first RF signal and a first sub-component of the second RF signal to the first radiating element and/or the third radiating element in a power-reduced coupling manner. A plurality of radiating elements in the first array are electrically connected to the first interface, and a plurality of radiating elements in the second array are electrically connected to the second interface, respectively.