In one embodiment of the present disclosure, an antenna assembly includes a patch antenna array including an upper patch antenna layer, a lower patch antenna layer, and a spacer therebetween, wherein the spacer includes a plurality of apertures defined by cell walls, wherein the each aperture aligns with an upper patch antenna element and a lower patent antenna element from the patch antenna array.

In one embodiment of the present disclosure, an antenna assembly includes a patch antenna array including an upper patch antenna layer, a lower patch antenna layer, and a spacer therebetween, wherein the spacer includes a plurality of apertures defined by cell walls, wherein the each aperture aligns with an upper patch antenna element and a lower patent antenna element from the patch antenna array.

Disclosed is an electronic device including a housing having a front surface, a rear surface, and a side surface partially surrounding a space between the front surface and the rear surface, wherein at least one of the front surface, the rear surface, and the side surface comprises a non-conductive portion, and at least a partial region of the non-conductive portion comprises a first through hole, a component at least partially overlapping the first through hole when the non-conductive portion is viewed from outside the housing, wherein the component is disposed at a position spaced apart from the non-conductive portion by a first distance, and an antenna structure disposed at a position spaced apart from the non-conductive portion by a second distance shorter than the first distance, wherein the antenna structure is configured to radiate radio waves through the non-conductive portion, and comprises at least one second through hole.

Disclosed is an electronic device including a housing having a front surface, a rear surface, and a side surface partially surrounding a space between the front surface and the rear surface, wherein at least one of the front surface, the rear surface, and the side surface comprises a non-conductive portion, and at least a partial region of the non-conductive portion comprises a first through hole, a component at least partially overlapping the first through hole when the non-conductive portion is viewed from outside the housing, wherein the component is disposed at a position spaced apart from the non-conductive portion by a first distance, and an antenna structure disposed at a position spaced apart from the non-conductive portion by a second distance shorter than the first distance, wherein the antenna structure is configured to radiate radio waves through the non-conductive portion, and comprises at least one second through hole.

A transportable ground tower for an aircraft landing system, and methods of assembling and raising the same, are disclosed. The ground tower may include at least lower and upper tower sections configured to be assembled to form a ground tower structure extending substantially vertically from a ground surface in an operational orientation. The lower tower section may have a pivot configured to be pivotally secured to a stationary ground base. The ground tower may also include a stand pivotably secured to one of the plurality of tower sections, which is configured to support an end of the assembled tower structure in an assembly orientation to permit assembly of one or more tower devices to the tower structure.

Disclosed is an antenna device, antenna system, and methods to create, and install or modify, an antenna profile for an antenna device so as to direct remotely the propagation of radio frequency signal from the antenna device to targeted radio frequency geographic coverage areas. Ports may be selected to activate spatial segments created by the configuration of the reflectors, joined about a cylindrical core, which may be quadrants when the reflectors are configured into a cross-like shape. The system provides aid in orienting an antenna, upon installation, to a pre-designated geographic heading. Optionally, the tilt of each quadrant of an antenna device may be determined so as to ensure proper radio frequency coverage.

Improved RFID devices and manufacturing methods that utilize more efficient RFID designs, result in less manufacturing material waste and increased recycling opportunities, all without sacrificing RFID device performance, are disclosed herein. Some exemplary embodiments of the improved RFID device may make use of a thinner foil, a hollowed-out foil, a “no-strip” design, or a tessellated design that may reduce material usage. Other exemplary embodiments may use a lower-impact and/or biodegradable adhesive so as to improve aluminum recycling and lessen risks to the environment.

An antenna system comprises at least one antenna, a feeding line and a cable guide for a line not feeding the at least one antenna. The at least one antenna has a feeding portion to which the feeding line is assigned. The cable guide has an opening that is provided in the feeding portion.

An electronic device including an antenna, according to one embodiment, is provided. The electronic device can comprise: a first radiator in which metal patterns having a predetermined width and length are stacked on different layers of a multi-layer substrate; and a second radiator in which metal patterns having a predetermined width and length are stacked on top of the first radiator. The electronic device can further comprise a transceiver circuit for connecting to any one metal pattern from among the first radiator and the second radiator through a feeding line.

A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.