A wireless communication apparatus includes a first conductor and a second conductor that function as a set of electrodes for wireless communication, a third conductor and a fourth conductor that function as another set of electrodes for wireless communication. A difference between a first distance between a centroid of the first conductor and a centroid of the third conductor and a second distance between a centroid of the second conductor and the centroid of the third conductor is less than a width of the first conductor and a width of the second conductor. A third distance between the centroid of the first conductor and a centroid of the fourth conductor is longer than the first distance. A fourth distance between the centroid of the second conductor and the centroid of the fourth conductor is longer than the second distance.

A wireless communication apparatus includes a first conductor and a second conductor that function as a set of electrodes for wireless communication, a third conductor and a fourth conductor that function as another set of electrodes for wireless communication. A difference between a first distance between a centroid of the first conductor and a centroid of the third conductor and a second distance between a centroid of the second conductor and the centroid of the third conductor is less than a width of the first conductor and a width of the second conductor. A third distance between the centroid of the first conductor and a centroid of the fourth conductor is longer than the first distance. A fourth distance between the centroid of the second conductor and the centroid of the fourth conductor is longer than the second distance.

An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer.

An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer.

Reconfigurable antennas are provided. A reconfigurable antenna includes a plurality of antenna radiators and a plurality of feeds that are electrically or electromagnetically coupled to the plurality of antenna radiators. The plurality of feeds control current or voltage of the plurality of antenna radiators. Related methods of operating a reconfigurable antenna are also provided.

Reconfigurable antennas are provided. A reconfigurable antenna includes a plurality of antenna radiators and a plurality of feeds that are electrically or electromagnetically coupled to the plurality of antenna radiators. The plurality of feeds control current or voltage of the plurality of antenna radiators. Related methods of operating a reconfigurable antenna are also provided.

An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

A printed dipole antenna includes a first printed dipole, a second printed dipole, a third printed dipole, a fourth printed dipole, a first feed line, a second feed line, a third feed line, and a fourth feed line. Feed lines parallel to the printed dipoles each include different segments, and each segment approaches a printed dipole on one side of the segment to suppress parasitic emission of the feed lines, and implement a low sidelobe level of the printed dipole antenna.

A printed dipole antenna includes a first printed dipole, a second printed dipole, a third printed dipole, a fourth printed dipole, a first feed line, a second feed line, a third feed line, and a fourth feed line. Feed lines parallel to the printed dipoles each include different segments, and each segment approaches a printed dipole on one side of the segment to suppress parasitic emission of the feed lines, and implement a low sidelobe level of the printed dipole antenna.