A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

An assembly includes a right-angled coaxial connector, a first coaxial cable and a second coaxial cable. The right-angled coaxial connector includes a first component and a second component connected to a first coaxial cable and a second coaxial cable respectively. The inner conductor and the outer conductor of the first coaxial cable and the first inner conductor and the first outer conductor of the first component, the inner conductor and the outer conductor of the second coaxial cable and the second inner conductor and the second outer conductor of the second component, as well as the first inner conductor and the first outer conductor of the first component and the second inner conductor and the second outer conductor of the second component are permanently connected in a single welding procedure through a first soldering element, a second soldering element and a third soldering element, respectively.

A coaxial juncture assembly 10 has a characteristic impedance Z.sub.0 and comprises an inner conductive formation 32 having opposed first and second ends 34.1, 34.2 which are connectable to an inner conductor of a coaxial cable and an inner conductor 18 of a port respectively. The cable has a characteristic impedance Z.sub.0 and the inner conductor has a diameter d.sub.1. The formation 32 has an outer diameter d.sub.1, which is larger than d.sub.1. A conductive tubular member 36 has an inner diameter D.sub.1, a first end 38.1, a second end 38.2, a slot 40 and an inner surface area A.sub.inner. The member 36 is connectable at end 38.1 thereof to an outer conductor of the cable and at the end 38.2 to an outer conductor of the port. The assembly 10 comprises a dielectric arrangement 42 having a dielectric constant .sub.eff. At least one of: a) .sub.eff and b) A.sub.inner is configured such that a difference between Z.sub.o and Z.sub.o is less than 3% and D.sub.1 and D.sub.1 varies by less than 5%.

A method for manufacturing a connection body capable of suppressing deformation of a connector having a terminal array with a narrow pitch and obtaining excellent insulation and conductivity, and the connection body. The method includes: a step of fixing, on a first terminal array of a substrate, via a thermosetting connection material containing solder particles, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less in the first terminal array and the second terminal array inside a bonding surface to be bonded with the substrate, and a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.