A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

The present invention relates to high-current plug-in connector components and a high-current plug-in connector. The high-current plug-in connector components comprise a plug body provided with a center hole and a cable connecting hole in an inner cavity thereof, a silver cap which is welded to outer side of an opening of the center hole, an elastic rubber arranged in the center hole, and a preset soldering tin arranged at the bottom of the inner side of the cable connecting hole, wherein the plug is slotted into three to six petals so that the plug is expanded to form an expansion plug; head of the high-current plug-in connector components and a heel part of the plug are in a plugging engagement with a socket component of corresponding plug-in connector, so that the high-current plug-in connector components are in an electric contact with corresponding plug-in connector component.

Provided is a method of bonding an operation wire used in a medical equipment. The method includes: locally heating an adjacent region of a bonding region of an operation wire to generate an oxide in the adjacent region of the operation wire; coating the bonding region and the adjacent region with flux to remove an oxide in the bonding region and the oxide in the adjacent region; inserting a bonding end portion of the operation wire into a through-hole of a coupling material; injecting a melted bonding material into between the coupling material and the operation wire to integrally bond the coupling material and the operation wire such that the oxide remaining in the adjacent region prevents wet-spreading of the bonding material.

A cable connection structure includes: a substrate including a first core wire connection electrode, a second core wire connection electrode, and a shield connection electrode; a single-wire cable including a first core wire, and an insulant; at least two coaxial cables each including a second core wire, an inner insulant, a shield, and an outer insulant, wherein the second core wire, the inner insulant, and the shield are exposed in a step-by-step manner at a distal end portion, and the second core wire and the shield are respectively connected to the second core wire connection electrode and the shield connection electrode; and a conductive member connecting exposed portions of the shields. The conductive member is disposed directly on an upper surface of the insulant, and connects the shields on the shield connection electrode and/or a position closer to a proximal end side than the shield connection electrode.

Provided is a soldering method for soldering a tip end of an electric wire to a soldering portion of a metallic terminal which allows the soldering to be performed with excellent workability. The method includes a damming structure forming step forming a damming structure at a periphery of the soldering portion to dam a solder which is supplied in a molten state with a flux to the soldering portion to keep the solder at the soldering portion, an electric wire setting step setting the tip end of the electric wire at the soldering portion ready for soldering, and a solder supplying step supplying the solder in the molten state with the flux to the soldering portion to perform the soldering.

A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.

An electrical connector includes an insulative housing with a plurality of passageways extending through opposite upper and lower surfaces of the housing. A plurality of electrical contacts are received within the corresponding passageways, respectively. Each contact includes a first main body and a second main body side by side arranged with each other with a bridge transversely linked therebetween. At least one of the first main body and the second main body includes a retaining barb for retaining contact in the passageway. Two soldering pads are formed on the corresponding bottom ends of the first main body and the second main body, respectively. The two soldering pads intimately confront each other either in a horizontal direction or in a vertical direction, and are joined together via a solder ball located under the two soldering pads.

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.

A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

The present disclosure relates to a process for integrally joining an electrical line to an electric contact part by means of a material bond. An exposed end of the line is inserted into a receiving sleeve of the contact part. Then a friction welding tool is rotated on an open end face of the receiving sleeve for the cohesive connection of the line end with the receiving sleeve. According to the disclosure, a powdery metal filler material is introduced into the receiving sleeve before rotation in such a way that the metal filler material is at least partially arranged between the line end and/or the receiving sleeve and the friction welding tool. Furthermore, the disclosure also concerns an electrical line arrangement which is manufactured with the aid of the metal filler material.