Provided is a signal cable including a connector (20) including a shell (21) that houses a connection terminal (22) to be connected to a connection terminal included in an electronic device and that is electrically connected to a frame ground of the electronic device in a state in which the connector (20) is connected to the electronic device, a cable body (10) including a ground connection wire electrically connected to the shell (21), and a supporting member (40) having a tubular shape and having a higher rigidity than the surface of the cable body (10). The connector-side end portion of the cable body (10) is led inside the supporting member (40), the connector-side end portion of the ground connection wire includes a folded portion that folded, and is disposed outside the supporting member (40), and the shell (21) is fixed to the cable body (10) in a state in which the folded portion is sandwiched between the shell (21) and the supporting member (40).

Provided herein are semiconductor packages with improved electrical contacts (e.g. pins). In some embodiments, an assembly may include a substrate and an electrical contact coupled to the substrate, the electrical contact consisting of a first component defined by a complex 3D designed receiving pin. The electrical contact may further include a second component defined by another complex 3D designed penetrating pin, wherein the first component engages the second component to deform mechanically and to weld when the first component and the second component are coupled together.

A ground block may include a metal ground plate and a ground wire fixedly coupled with the metal ground plate. The ground wire is configured to be non-detachable from the ground block during normal use of the ground block. The ground block may be formed by soldering, brazing, or clamping the ground wire to the metal ground plate.

A connection structure for an electric wire includes an electric wire that has a conductor and an outer sheath covering the conductor; a bonding member that is made of a conductive metal material and is attached to the electric wire and; and a busbar that is made of a conductive metal material and on which the bonding member is overlapped and ultrasonically bonded with the conductor interposed between the busbar and the bonding member. The bonding member includes a crimping portion for crimping and fixing the electric wire.

In various examples, a component for a medical device is described. The component includes a conductor wire including a connection portion. An electrode is formed from a conductive tube. The conductive tube is compressed at least partially around the connection portion of the conductor wire to at least partially surround and couple to the connection portion.

A connecting structure includes at least one conductive terminal having a body, a conducting portion connected below the body, a pre-breaking portion provided at an upper end of the body, and a temporary soldering portion connected above the pre-breaking portion; a first strip connected to the conducting portion; and a second strip soldered to the temporary soldering portion. A method for manufacturing an electrical connector includes: forming a first strip and at least one conductive terminal connected thereto; soldering a second strip to the temporary soldering portion of the conductive terminal; separating the conducting portion of the conductive terminal and the first strip; operating the second strip to control the conductive terminal to be mounted to a housing; and disconnecting the pre-breaking portion of the conductive terminal, and removing the second strip and the temporary soldering portion of the conductive terminal.

A terminal connecting method includes setting a conductor having a plurality of strands on an upper surface of a bottom portion of an electric wire crimping part of a terminal, caulking the conductor in a manner to cover the conductor, thereby crimping the conductor by a caulking portion extended from the bottom portion, and welding the plurality of strands together in a strands exposed portion of the conductor exposed from tip end edges of the caulking portion by friction between the plurality of strands and a friction tool, after caulking and crimping.

This disclosure relates to a method for connecting a strand element to a connection element using a re-shaping method, such as a connecting a cable lug. A system is also disclosed which comprises a pair of receiving elements having a front side with a recess and a hollow section. The hollow section is designed to accommodate a press insert having a front side with a recess. The receiving element and the press inserts are arranged in a vice. The system also comprises a clamp having a front side with a recess, which is suitable for receiving the connection element. When a pair of receiving elements is arranged, together with the press insert, around a central region of the connection element, then a re-shaping connection, such as a crimp connection, is produced between the strand element and the connection element.

A method for establishing a materially bonded current path connection in low-voltage, medium-voltage and/or high-voltage installations having long-term stability includes providing a first part and/or a second part of a current path with a nanomaterial at least in one region. The first part and the second part of the current path are force-lockingly or form-lockingly connected at least in the respective regions. A supply of a reaction energy together with the nanomaterial creates a conductive and bonded connection between the first part and the second part of the current path. A low-voltage installation, a medium-voltage installation and/or a high-voltage installation is also provided.

A joint structure includes an end portion of the flat electric wire assembly, a terminal fitting, and solder. The flat electric wire assembly includes a conductive line, a first insulating layer covering the conductive line, and a second insulating layer covering a portion of the conductive line. The terminal fitting includes a joint portion that includes a receiving section on which the end portion is placed and blocking sections extending from the receiving section such that the end portion is between the blocking sections. The first insulating layer includes a first surface opposed to the receiving section and a second surface on which the conductive line is disposed. The conductive line includes an end portion different from the portion covered with the second insulating layer. The solder is disposed over the second surface. The blocking sections include surfaces over which the solder is not disposed.