An integrated circuit die is disclosed that comprises a substrate defining a plurality of circuit elements; a sensor region on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells; and an interposer region on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts for contacting the integrated circuit die to a connection cable and mounting pads for mounting a passive component on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

Corrosion within a flangeless connector, or at an associated connection of a device or medium (e.g., cable), used in a wireless base station may be reduced by incorporating a seating member, e.g., an O-ring, between the connector and a connector port. Conductive plating selectively applied within the connector port may provide a low-resistance ground connection between the port and the connector, while a non-conductive coating selectively applied to a surface against which the seating member is seated may form a weather-tight seal. The connection between the connector and the connector port is thereby protected from moisture, while exposed surfaces of the connector port re protected by the non-conductive coating.

A shielded electrical cable includes conductor sets extending along a length of the cable and spaced apart from each other along a width of the cable. First and second shielding films are disposed on opposite sides of the cable and include cover portions and pinched portions arranged such that, in transverse cross section, the cover portions of the films in combination substantially surround each conductor set. An adhesive layer bonds the shielding films together in the pinched portions of the cable. A transverse bending of the cable at a cable location of no more than 180 degrees over an inner radius of at most 2 mm causes a cable impedance of the selected insulated conductor proximate the cable location to vary by no more than 2 percent from an initial cable impedance measured at the cable location in an unbent configuration.

A method is described for electrically connecting a coaxial conductor to a circuit carrier, in particular a printed circuit board. The circuit carrier has a top side and a bottom side, and printed conductors are situated at least on the top side of the circuit carrier. The coaxial conductor also includes an inner conductor and an outer conductor, the coaxial conductor being led, at least partially, from the bottom side of the circuit carrier through a feedthrough provided in the circuit carrier. In addition, at least one first contact conductor is used for electrically connecting the outer conductor to at least one first printed conductor of the circuit carrier, and at least one second contact conductor is used for electrically connecting the inner conductor to at least one second printed conductor of the circuit carrier. The first and the second contact conductors each have a press-in connection at at least one of their contact points with the circuit carrier or with the coaxial conductor.

Cable assemblies that may convey high speed signals while providing reduced signal noise, radiation, and susceptibility to interference. These and other examples may be readily manufactured. These and other examples may provide cables having a reduced thickness.

A cable connection structure includes cables and a substrate having an electrode thereon. The cables are configured to be connected to the electrode. Each cable includes: a core wire formed of conductive material; a tubular inner insulator for covering an outer circumference of the core wire; a shield which extends along a longitudinal direction of the inner insulator and includes conductors for covering an outer circumference of the inner insulator, and has an exposed portion for exposing the inner insulator; and an outer insulator for covering an outer circumference of the shield. The shield including a region where the exposed portion is formed, the inner insulator, and the core wire are exposed in a stepped manner toward a distal end of each cable. The substrate includes a first electrode configured to be electrically connected to the core wire, and a second electrode configured to be electrically connected to the shield.

A photoelectric composite module including a first connecting member having an outer frame having a tubular shape, and a plurality of contacts provided in an interior of the outer frame, a first printed board on which a photoelectric conversion element configured to convert an electrical signal into an optical signal is mounted, and which is configured to act as a relay between the contacts and the photoelectric conversion element and a second printed board configured to act as a relay between the contacts and an electrical signal cable. The first printed board and the second printed board are three-dimensionally arranged.

A cable assembly comprises a cable and a conductive member. The cable extends in a longitudinal direction. The cable has a first location and a second location in the longitudinal direction. The cable comprises a conductive portion and an outer cover. The outer cover covers the conductive portion. The conductive member is attached with the cable. The conductive member has a first portion, a second portion and a planar portion. The first portion is positioned at the first location in the longitudinal direction. The first portion is crimped to the outer cover. The second portion is positioned at the second location in the longitudinal direction. The second portion is crimped to the conductive portion. The planar portion extends from the first location to the second location in the longitudinal direction.

A cable termination assembly configured for mounting to an interior portion of a printed circuit board. The cable termination assembly has a frame shaped to receive a paddle card to which a plurality of cables are terminated. A lid, when closed, may force the paddle card into contact with an interposer, which in turn may be pressed into a printed circuit board on which the cable termination assembly is mounted. Electrical signals may pass between the cables and traces in the printed circuit board via the paddle card and interposer. The termination assembly may be mounted near a processor or other high speed component on the printed circuit board, enabling high speed signals to be coupled with low loss between a periphery of the printed circuit board, or even a location off the printed circuit board, and the high speed component.

A shielded electrical cable includes conductor sets extending along a length of the cable and spaced apart from each other along a width of the cable. First and second shielding films are disposed on opposite sides of the cable and include cover portions and pinched portions arranged such that, in transverse cross section, the cover portions of the films in combination substantially surround each conductor set. An adhesive layer bonds the shielding films together in the pinched portions of the cable. A transverse bending of the cable at a cable location of no more than 180 degrees over an inner radius of at most 2 mm causes a cable impedance of the selected insulated conductor proximate the cable location to vary by no more than 2 percent from an initial cable impedance measured at the cable location in an unbent configuration.