In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.

According to one embodiment, an electronic device includes: a housing; a first electronic component inside the housing; a second electronic component arranged inside the housing and spaced apart from the first electronic component; a female connector electrically connected to the second electronic component, the female connector comprising multiple conductive pins; a male connector electrically connected to the first electronic component and configured to contact at least some of the multiple conductive pins of the female connector, the male connector comprising a base film, a conductive layer formed on one surface of the base film, and an adhesive layer formed on the back surface of the base film, thereby forming a lamination structure; and multiple reinforcement members provided on at least one of one surface of the base film and the back surface thereof so as to form a peripheral portion of the lamination structure.

A high-frequency line structure includes: a high-frequency line substrate; ground lead pins fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins are arranged between the ground lead pins, the signal lead pins have a structure in which each of the signal lead pins springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins pertains, and spring-up heights in the structure in which the respective signal lead pins spring up are substantially the same.

An electrical outlet mount for externally mounting on a pair of conductive panes or conductive material on a pair of non-conductive panes. The mount is used for powering electrical/electronic elements and can be installed quickly and easily, and which offers an attractive finish with unobstructed view. The electrical outlet mount has a back end and a front end, a first electrical contact element located at the back end arranged for electrical contact with a first conductive panel and a second electrical contact element located towards the front end, in spaced arrangement from the first electrical contact element for electrical contact with a second conductive panel. The electrical outlet mount may extend out through an opening in one of the panels to receive electrical/electronic elements disposed externally to such space.

An electrical outlet mount for externally mounting on a pair of conductive panes or conductive material on a pair of non-conductive panes. The mount is used for powering electrical/electronic elements and can be installed quickly and easily, and which offers an attractive finish with unobstructed view. The electrical outlet mount has a back end and a front end, a first electrical contact element located at the back end arranged for electrical contact with a first conductive panel and a second electrical contact element located towards the front end, in spaced arrangement from the first electrical contact element for electrical contact with a second conductive panel. The electrical outlet mount may extend out through an opening in one of the panels to receive electrical/electronic elements disposed externally to such space.

The invention relates to a multi-way connector (4) for electrically contacting electrical assemblies (2, 3). The multi-way connector (4) comprises a connector body (5) having a first connection surface (6) and having a second connection surface (7). The multi-way connector (1) also comprises a plurality of electrical contact elements (8), which extend through the connector body (5) at least from the first connection surface (6) to the second connection surface (7). The contact elements (8) form contact sections (9) in the region of the connection surfaces (6, 7) for electrically contacting corresponding counter contact elements (10) of the respective associated assembly (2, 3). The contact sections (9) on at least one of the connection surfaces (6, 7) can be mechanically secured to the respective associated counter contact elements (10). According to the invention, the connector body (5) has multiple foil elements (11) that are stacked on one another and connected to one another. A respective two of the foil elements (11) form a foil pair (12). At least one of the contact elements (8) runs between the two stacked foil elements (11) of at least one of the foil pairs (12).

Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.

Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.

Devices and methods for a sealed electrical connector are described herein. Some embodiments include a spring connecting a first PCB to a second PCB, wherein the spring includes a first end portion in contact with the first PCB, a second end portion in contact with the second PCB, and a middle portion extending between the first end portion and the second end portion, a spacer surrounding the middle portion of the spring, a first seal seated in a first groove of the spacer and in contact with the first PCB, and a second seal seated in a second groove of the spacer and in contact with the second PCB.

Devices and methods for a sealed electrical connector are described herein. Some embodiments include a spring connecting a first PCB to a second PCB, wherein the spring includes a first end portion in contact with the first PCB, a second end portion in contact with the second PCB, and a middle portion extending between the first end portion and the second end portion, a spacer surrounding the middle portion of the spring, a first seal seated in a first groove of the spacer and in contact with the first PCB, and a second seal seated in a second groove of the spacer and in contact with the second PCB.