Patent classifications
H01R12/61
FLEXIBLE CIRCUIT BOARD, TOUCH DISPLAY MODULE AND TOUCH DISPLAY APPARATUS
A flexible circuit board includes a first substrate, display panel signal traces, a touch chip, at least one second substrate, a touch auxiliary device, first touch signal traces and at least one second touch signal trace. The display panel signal traces, the touch chip and the at least one second substrate are located on the same side of the first substrate; and the touch auxiliary device is located on a second substrate. The first touch signal trace includes a first connection trace and a first transfer trace that are electrically connected to each other. The second touch signal trace includes a second connection trace and a second transfer trace that are electrically connected to each other. The first connection trace and the second connection trace are disposed on the first substrate, and the first transfer trace and the second transfer trace are disposed on the at least one second substrate.
FLEXIBLE CIRCUIT BOARD, TOUCH DISPLAY MODULE AND TOUCH DISPLAY APPARATUS
A flexible circuit board includes a first substrate, display panel signal traces, a touch chip, at least one second substrate, a touch auxiliary device, first touch signal traces and at least one second touch signal trace. The display panel signal traces, the touch chip and the at least one second substrate are located on the same side of the first substrate; and the touch auxiliary device is located on a second substrate. The first touch signal trace includes a first connection trace and a first transfer trace that are electrically connected to each other. The second touch signal trace includes a second connection trace and a second transfer trace that are electrically connected to each other. The first connection trace and the second connection trace are disposed on the first substrate, and the first transfer trace and the second transfer trace are disposed on the at least one second substrate.
Flexible printed circuit board
A flexible printed circuit board includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on an opposite surface of the base film and situated at least at a position opposite the terminal connecting area, wherein the reinforcement member has one or more lines of hollow holes aligning with a width direction thereof.
CABLE CONNECTOR
A cable connector relates to a field of cable connecting technology. The cable connector includes a main body assembly including an insulating main body and conductive main bodies, a first clamping assembly, and a second clamping assembly. The conductive main bodies are disposed on the insulating main body. Two ends of each of the conductive main bodies extend outwards from bottom portions of the first accommodating groove and the second accommodating groove. The two ends of each of the conductive main bodies are sharp structures. The first clamping assembly includes a first clamping piece movably disposed up and down in the first accommodating groove and a first operating piece disposed on the insulating main body. The second clamping assembly includes a second clamping piece movably disposed up and down in the second accommodating groove and a second operating piece disposed on the insulating main body.
THIN TYPE LOCK AND UNLOCK CONNECTOR
A thin type lock and unlock connector include a first shell, a second shell and an first insulator, which are buckled and combined with each other by the respective provided first fixing members to form a connector that can be connected to a flexible printed circuit board. The second shell provides a first locking member and a first elastic member to lock the flexible printed circuit board to the connector. When an external force is applied to the first pressing part of the first shell, it acts on the locking member to unlock the flexible printed circuit board that the flexible printed circuit board can be detached from the connector. The first insulator provides an action portion with a slope to be arranged corresponding to the first locking member, to determine the deformation stroke of the first locking member.
SYSTEMS AND METHODS FOR PROVIDING LED CONNECTORS
Connectors for LED strips are disclosed having channels for removable conductors. These connectors are configured to receive conductors adapted to electrically connect two LED strips, or a single LED strip and an appropriate number of wires. The connectors and conductors may include sloped ramps that provide support to the LED strips.
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.
FLEXIBLE PRINTED CIRCUIT BOARD ARRANGEMENT
There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements. The interleaved and interlocked first and second plurality of electrically conductive coupling elements may form a plurality of conductive-bridges and the interleaved and interlocked first and second plurality of non-electrically conductive coupling elements may form a plurality of insulation-bridges.
METHOD FOR BONDING FLEXIBLE ELECTRONIC CIRCUIT ELEMENTS
A first flexible electronic circuit includes a non-conductive substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. A second flexible electronic circuit likewise includes a substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. The second flexible electronic circuit also includes a conductive interface layer on an opposite surface of the non-conductive substrate to the bonding pad. A plurality of vias, filled with conductive material, extend through the substrate of the second flexible electronic circuit and couple the conductive interface layer to the bonding pad. The bonding pads are brought in contact with each other, and energy (e.g., ultrasonic energy or thermal energy) is applied to the conductive interface layer until the bonding pads are bonded (e.g., ultrasonically welded or soldered) to each other.
METHOD FOR BONDING FLEXIBLE ELECTRONIC CIRCUIT ELEMENTS
A first flexible electronic circuit includes a non-conductive substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. A second flexible electronic circuit likewise includes a substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. The second flexible electronic circuit also includes a conductive interface layer on an opposite surface of the non-conductive substrate to the bonding pad. A plurality of vias, filled with conductive material, extend through the substrate of the second flexible electronic circuit and couple the conductive interface layer to the bonding pad. The bonding pads are brought in contact with each other, and energy (e.g., ultrasonic energy or thermal energy) is applied to the conductive interface layer until the bonding pads are bonded (e.g., ultrasonically welded or soldered) to each other.