Patent classifications
H01R12/61
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.
ROTARY CONNECTOR DEVICE AND FLAT CABLE ASSEMBLY FOR ROTARY CONNECTOR DEVICE
A flat cable assembly for a rotary connector device includes a first lead block, a first flat cable, and a second flat cable. The first lead block includes a first lead block body and a first conductor that includes a first exposure surface exposed from the first lead block body and is attached to the first lead block body. The first flat cable includes a first cable end portion connected to the first exposure surface so as to extend from the first exposure surface in a first direction. The second flat cable includes a second cable end portion connected to the first exposure surface so as to extend from the first exposure surface in a second direction, which is different from the first direction.
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A display device and a manufacturing method thereof are provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A display device and a manufacturing method thereof are provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.
Preparation device and process for anisotropic conductive film (ACF) bonding structure
A preparation device and a process for an anisotropic conductive film (ACF) bonding structure are provided. The preparation device includes a negative-pressure adsorption device, a positioning assembly, and a hot-pressing module, where the negative-pressure adsorption device is configured to adsorb a first metal plate; the positioning assembly includes a first positioning module, at least two second positioning modules, and at least one third positioning module; and the hot-pressing module is configured to release a hot-pressing pressure, such that the second metal plate is connected to the first metal plate through an ACF to form a bonding structure. The present disclosure ensures reference positioning of the negative-pressure adsorption device on a mounting plate through the second positioning modules. The present disclosure further ensures that a side of the first metal plate is fully adhered to a side surface of an adsorption plate through the first positioning module.
WIRING HARNESS ASSEMBLY
A flexible planar wire cable includes a first flexible planar wire having first conductor segments contained in a first longitudinal plane and second conductor segments contained in a second longitudinal plane. First connection segments extend between the first conductor segments and the second conductor segments. The first conductor segments alternate with second conductor segments along a longitudinal axis of the wire harness assembly. The cable further includes a second flexible planar wire having third conductor segments contained in the second longitudinal plane and fourth conductor segments contained in the first longitudinal plane. Second connection segments extend between the third conductor segments and the fourth conductor segments. The third conductor segments alternate with the fourth conductor segments along the longitudinal axis of the flexible planar wire cable. The cable also includes an insulating layer separating and encasing the first and second flexible planar wires.
WIRING HARNESS ASSEMBLY
A flexible planar wire cable includes a first flexible planar wire having first conductor segments contained in a first longitudinal plane and second conductor segments contained in a second longitudinal plane. First connection segments extend between the first conductor segments and the second conductor segments. The first conductor segments alternate with second conductor segments along a longitudinal axis of the wire harness assembly. The cable further includes a second flexible planar wire having third conductor segments contained in the second longitudinal plane and fourth conductor segments contained in the first longitudinal plane. Second connection segments extend between the third conductor segments and the fourth conductor segments. The third conductor segments alternate with the fourth conductor segments along the longitudinal axis of the flexible planar wire cable. The cable also includes an insulating layer separating and encasing the first and second flexible planar wires.
HIGH-SPEED TRANSMISSION CABLE AND CABLE END CONNECTOR INCLUDING THE SAME
A high-speed transmission cable and a cable end connector including the same are provided. The cable end connector includes a connector body and the high-speed transmission cable that includes at least one cable assembly, at least one transmission line, and an insulating material. The at least one cable assembly includes multiple ground wires and multiple differential pairs that are arranged at fixed intervals and in parallel with each other, an insulating layer, and at least one shielding layer. Each of the differential pairs includes two signal wires that are adjacently arranged, and is located between two adjacent ones of the ground wires. The insulating layer covers the ground wires and the differential pairs. The at least one shielding layer is located at an outer side of the insulating layer. The insulating material covers the at least one cable assembly and the at least one transmission line.
HIGH-SPEED TRANSMISSION CABLE AND CABLE END CONNECTOR INCLUDING THE SAME
A high-speed transmission cable and a cable end connector including the same are provided. The cable end connector includes a connector body and the high-speed transmission cable that includes at least one cable assembly, at least one transmission line, and an insulating material. The at least one cable assembly includes multiple ground wires and multiple differential pairs that are arranged at fixed intervals and in parallel with each other, an insulating layer, and at least one shielding layer. Each of the differential pairs includes two signal wires that are adjacently arranged, and is located between two adjacent ones of the ground wires. The insulating layer covers the ground wires and the differential pairs. The at least one shielding layer is located at an outer side of the insulating layer. The insulating material covers the at least one cable assembly and the at least one transmission line.