A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

A terminal assembly and an electrical connector. The terminal assembly comprises a plurality of terminals, an insulating body, a first electromagnetic shielding member, and a second electromagnetic shielding member. The plurality of terminals comprises a plurality of signal terminals and a plurality of ground terminals. The signal terminals and the ground terminals are disposed at intervals. At least one signal terminal is disposed between two adjacent ground terminals. The insulating body is disposed at the plurality of terminals. One end of each terminal protrudes from one side of the insulating body, while the other end is exposed from the insulating body. The first electromagnetic shielding member is disposed at one side of the insulating body and is connected with the plurality of ground terminals. The second electromagnetic shielding member is disposed at the other side of the insulating body and is opposite to the first electromagnetic shielding member.

To provide a coaxial flat cable that can achieve stable high-frequency transmission characteristics as a structure by which stress is not applied to a specific coaxial cable, even due to handling of the coaxial flat cable or the like. The above-described problem is solved by a coaxial flat cable (20) comprising a plurality of coaxial cables (10) disposed side by side in a width direction (X), and a resin tape (11) integrating at least terminal parts (21) of these coaxial cables (10) from one surface or both surfaces, each of the plurality of coaxial cables (10) being connected by soldering to a substrate (30) or a connector. The resin tape (11) positioned at the terminal parts (21) is configured to be provided with a fixed part (21a), to be fixed to the substrate or the connector, at both end portions in the width direction (X).

Examples are disclosed relating to cable connectors for attachment to a printed circuit board (PCB). In one example, a cable connector comprises a flexible printed circuit (FPC) comprising a plurality of FPC alignment apertures, a stiffener plate comprising a plurality of stiffener alignment apertures, and a plurality of alignment pins extending through the plurality of stiffener alignment apertures and the plurality of FPC alignment apertures and into a plurality of PCB apertures in the PCB. The plurality of alignment pins align the FPC to the PCB.

A method for manufacturing a connection body capable of suppressing deformation of a connector having a terminal array with a narrow pitch and obtaining excellent insulation and conductivity, and the connection body. The method includes: a step of fixing, on a first terminal array of a substrate, via a thermosetting connection material containing solder particles, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less in the first terminal array and the second terminal array inside a bonding surface to be bonded with the substrate, and a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.

An optical device comprises at least one printed circuit board, the printed circuit board includes an electronic image-capture circuit, a lens holder comprising at least one optical lens, the lens holder comprising a wall forming a cavity extending along the optical axis of the device from its top end to its bottom end, the bottom end being mounted on the rigid printed circuit board so as to align, along the optical axis of the device, the electronic image-capture circuit and the optical lens, a flexible heater band arranged in contact with the wall of the lens holder and around the wall of the lens holder, the heater band comprising an electrical connection interface electrically connected to at least one rigid printed circuit board of the optical device.

An optical device comprises at least one printed circuit board, the printed circuit board includes an electronic image-capture circuit, a lens holder comprising at least one optical lens, the lens holder comprising a wall forming a cavity extending along the optical axis of the device from its top end to its bottom end, the bottom end being mounted on the rigid printed circuit board so as to align, along the optical axis of the device, the electronic image-capture circuit and the optical lens, a flexible heater band arranged in contact with the wall of the lens holder and around the wall of the lens holder, the heater band comprising an electrical connection interface electrically connected to at least one rigid printed circuit board of the optical device.

A printed circuit board includes a first transmission line provided on an insulating base, a first ground conductor, a notch portion that exposes a part of the first ground conductor, a conductor provided in the notch portion and electrically connected to the first ground conductor, and a first electrode exposed on a main surface of the insulating base facing a flexible board and electrically connected to the first transmission line. The flexible board includes a second transmission line provided on an insulating sheet, a second ground conductor, a second electrode exposed on a main surface of the insulating sheet facing the printed circuit board and connected to the second transmission line, and a third electrode exposed on the main surface of the insulating sheet and connected to the second ground conductor. The conductor and the third electrode are connected by solder.

A printed circuit board includes a first transmission line provided on an insulating base, a first ground conductor, a notch portion that exposes a part of the first ground conductor, a conductor provided in the notch portion and electrically connected to the first ground conductor, and a first electrode exposed on a main surface of the insulating base facing a flexible board and electrically connected to the first transmission line. The flexible board includes a second transmission line provided on an insulating sheet, a second ground conductor, a second electrode exposed on a main surface of the insulating sheet facing the printed circuit board and connected to the second transmission line, and a third electrode exposed on the main surface of the insulating sheet and connected to the second ground conductor. The conductor and the third electrode are connected by solder.