A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.

Connectors providing solderless contact between conductors and a plurality of contact pads disposed on a substrate are disclosed. Connectors accommodating cables including pairs of insulated conductors are disclosed. Connector assemblies including frames for reversibly mounting the connectors with substrates having a plurality of contact pads are also disclosed.

Connectors providing solderless contact between conductors and a plurality of contact pads disposed on a substrate are disclosed. Connectors accommodating cables including pairs of insulated conductors are disclosed. Connector assemblies including frames for reversibly mounting the connectors with substrates having a plurality of contact pads are also disclosed.

A single-row electrical wire structure includes a first circuit board and a wire assembly. A board-to-board connector is on the first circuit board. The first circuit board includes a first group of contacts arranged into a single row. A distance between center portions of adjacent two contacts of the first group of contacts forms a width. The wires assembly includes a plurality of high-speed signal pairs and at least one low-speed signal pair respectively connected to the first group of contacts. A first spacing between a contact in the first group of contacts corresponding to a first high-speed signal pair of the high-speed signal pairs and a contact in the first group of contacts corresponding to a second high-speed signal pair of the high-speed signal pairs adjacent to the first high-speed signal pair is at least equal to or greater than 2 times of the width.

An integrated circuit die is disclosed that comprises a substrate defining a plurality of circuit elements; a sensor region on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells; and an interposer region on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts for contacting the integrated circuit die to a connection cable and mounting pads for mounting a passive component on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

An integrated circuit die is disclosed that comprises a substrate defining a plurality of circuit elements; a sensor region on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells; and an interposer region on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts for contacting the integrated circuit die to a connection cable and mounting pads for mounting a passive component on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

A connector system includes a housing with a paddle card. One side of the paddle card includes a plurality of rows of signal terminations. Another side of the paddle card includes a single row of cable terminations. Cable management members may be used to support the rows of signal terminations. A shield member may be used to improve the electrical performance of the signal terminations.

A connector system includes a housing with a paddle card. One side of the paddle card includes a plurality of rows of signal terminations. Another side of the paddle card includes a single row of cable terminations. Cable management members may be used to support the rows of signal terminations. A shield member may be used to improve the electrical performance of the signal terminations.