Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

A flat conductor electric connector mounted on a circuit board and electrically connected to a front end side portion of a band-shaped flat conductor extending in a front-back direction, comprising: multiple terminals in such a shape that metal plate members are bent in a plate thickness direction thereof; and a housing holding, by insert molding, the multiple terminals arrayed in a terminal array direction which is a band width direction, wherein each of the multiple terminals has, at least at one end portion in the front-back direction, a holding target portion held on the housing and an extending portion extending from the housing and formed with a mounting portion to be mounted on the circuit board by soldering, and the holding target portions adjacent to each other and the extending portions adjacent to each other are arrayed and positioned in the terminal array direction.

A flat conductor electric connector mounted on a circuit board and electrically connected to a front end side portion of a band-shaped flat conductor extending in a front-back direction, comprising: multiple terminals in such a shape that metal plate members are bent in a plate thickness direction thereof; and a housing holding, by insert molding, the multiple terminals arrayed in a terminal array direction which is a band width direction, wherein each of the multiple terminals has, at least at one end portion in the front-back direction, a holding target portion held on the housing and an extending portion extending from the housing and formed with a mounting portion to be mounted on the circuit board by soldering, and the holding target portions adjacent to each other and the extending portions adjacent to each other are arrayed and positioned in the terminal array direction.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

The invention relates to an apparatus, system and method for a direct flex cable to flex cable connection, with guides through which the said flex cables are aligned upon insertion and a pressing mechanism which in its latched state perfectly aligns corresponding guides to each other and by extension also aligns corresponding contact pads on the flex cables, and brings them into firm electrical contact.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

A testing device and a method for testing a semiconductor device are provided. The testing device includes a socket having a cavity for accommodating a device under test (DUT), and a cover disposed on the socket. The socket includes a thermal conductive material. The cover includes a plate, a circuit board attached to the plate, and an opening penetrating the plate and the circuit board, exposing the cavity of the socket.

A testing device and a method for testing a semiconductor device are provided. The testing device includes a socket having a cavity for accommodating a device under test (DUT), and a cover disposed on the socket. The socket includes a thermal conductive material. The cover includes a plate, a circuit board attached to the plate, and an opening penetrating the plate and the circuit board, exposing the cavity of the socket.