Aspects of the disclosure provide a package system that includes a first integrated circuit (IC) package and a second IC package. The first IC package includes a first IC chip mounted on a first substrate-chip surface of a first package substrate. The first package substrate includes first near-conductive layers that are closer to the first substrate-chip surface than first far-conductive layers. The second IC package includes a second IC chip mounted on a second substrate-chip surface of a second package substrate. The second package substrate includes second near-conductive layers that are closer to the second substrate-chip surface than second far-conductive layers. A first contact structure on the first substrate-chip surface and a second contact structure on the second substrate-chip surface electrically couple the first IC chip with the second IC chip through electrical connections in the first and second near-conductive layers.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

A base of a connector defines an accommodation portion for accommodating a card-type device. The base has holding portions with surfaces directed to the accommodation portion. The holding portions hold held portions of terminals 40. Heat conductive members are provided on the surfaces of the holding portions. The heat conductive members are sandwiched between the card-type device and the holding portions when the card-type device is connected to the connector 10. In this way, heat conductive paths, which include the conductive members, are formed between the card-type device and held portions of the terminals 40.

A soft neural interface connector apparatus includes a PCB having a two-dimensional array of solder balls, a transparent top board, a cushioning layer on one side of the transparent top board, and a soft neural interface including a flexible and/or stretchable microelectrode array (MEA) through which neural signals are obtained or delivered. The MEA includes a two-dimensional array of contact pads corresponding to the array of solder balls. The PCB, the transparent top board, the cushioning layer, and the MEA are stacked together such that the MEA is between the cushioning layer and the PCB, and the contact pads are aligned with and in electrical contact with associated solder balls. A magnetic connector system having at least one magnetic connector component on the transparent top board is magnetically connected with at least one magnetic connector component on the PCB to press the contact pads and associated solder balls together.

A soft neural interface connector apparatus includes a PCB having a two-dimensional array of solder balls, a transparent top board, a cushioning layer on one side of the transparent top board, and a soft neural interface including a flexible and/or stretchable microelectrode array (MEA) through which neural signals are obtained or delivered. The MEA includes a two-dimensional array of contact pads corresponding to the array of solder balls. The PCB, the transparent top board, the cushioning layer, and the MEA are stacked together such that the MEA is between the cushioning layer and the PCB, and the contact pads are aligned with and in electrical contact with associated solder balls. A magnetic connector system having at least one magnetic connector component on the transparent top board is magnetically connected with at least one magnetic connector component on the PCB to press the contact pads and associated solder balls together.

An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.

An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.

An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.

An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.