A floating connector comprises a movable housing, a plurality of contacts and at least one ground member. Each of the contacts has a fixed portion, a first held portion, a coupling portion, an extending portion and a contact portion. The coupling portion is resiliently deformable. The movable housing is movable within a predetermined range in a plane perpendicular to an up-down direction by the resilient deformation. The contacts include a plurality of ground contacts and a signal contact. The ground member has a plurality of ground contact portions, a plurality of supporting portions, a ground coupling portion and a second held portion. The ground contact portions correspond to the ground contacts, respectively. Each of the ground contact portions is brought into contact with the corresponding ground contact even when the movable housing is moved within the predetermined range. The ground coupling portion couples the supporting portions with each other.

A floating connector comprises a movable housing, a plurality of contacts and at least one ground member. Each of the contacts has a fixed portion, a first held portion, a coupling portion, an extending portion and a contact portion. The coupling portion is resiliently deformable. The movable housing is movable within a predetermined range in a plane perpendicular to an up-down direction by the resilient deformation. The contacts include a plurality of ground contacts and a signal contact. The ground member has a plurality of ground contact portions, a plurality of supporting portions, a ground coupling portion and a second held portion. The ground contact portions correspond to the ground contacts, respectively. Each of the ground contact portions is brought into contact with the corresponding ground contact even when the movable housing is moved within the predetermined range. The ground coupling portion couples the supporting portions with each other.

Memory on Package (MOP) apparatus with reverse CAMM (Compression Attached Memory Module) and compression mount technology (CMT) connector(s). The MOP includes a first (MOP) substrate to which one or more CPUs, SoC, and XPUs that is operatively coupled to one or more CAMMs with a CMT connector(s) disposed between an array of CMT contact pads on the CAMM substrate and an array of CMT contact pad on the substrate. The one or more CAMMs are include multiple memory chips or packages such as LP DDR chips or DDR (S)DRAM chips/packages mounted to an underside of the CAMM substrate via signal coupling means such as a ball grid array (BGA), where the CAMM orientation is inverted such that the memory chips/packages are disposed downward, resulting in a reduced Z-height of the MOP. A MOP may include two CAMMs with a respective CMT connector disposed between the CAMM substrates and the MOP substrate.

Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.

Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.

A system connects a board to a substrate through an interposer board having compressible connectors through the interposer board. The connectors through the interposer board are compression-based connector pins that extends above and below the interposer board to make electrical contact between the board and the substrate. The system can include a plate to secure the board to the substrate and compress the compression-based connectors of the interposer board.

The invention is an implantable electrical connection between an electrical implant which has at least one electrical conductor and at least one electrical feed line. The invention further relates to a method for producing an implantable electrical connection between an electrical implant. The invention comprises at least one electrical cable having a cable end, to which an electrically conductive flat piece is unsupportedly fined, and that the at least one implant-side electrical conductor is joined to the flat piece.

A sheet connector according to the present invention has: a first insulating layer having a first surface positioned on one side in the thickness direction, a second surface positioned on the other side, and a plurality of first through-holes passing through between the first surface and the second surface; and a plurality of first conductive layers arranged on the inner wall surfaces of the first through-holes. First ends of the first conductive layers on the first surface side project from the first surface.

A spring connector includes: a conductive tube; a movable pin that has a tip end portion protruding from an opening of the tube along an axial direction of the tube; a movable body that is provided inside the tube and that has one end portion in contact with a rear end portion of the movable pin; and a spring that is provided inside the tube and that is configured to urge another end portion of the movable body in a direction in which the movable pin protrudes. The other end portion of the movable body is an inclined surface inclined with respect to the axial direction, and at least one of the one end portion of the movable body and the rear end portion of the movable pin includes a convex portion.

A connector includes a housing and a contact elongated in a frontward and rearward direction. The contact has a fixed portion fixed to the housing in a middle in the frontward and rearward direction, a first contact portion formed in a front end portion for coming into contact with a first circuit board, a second contact portion formed in a rear end portion for coming into contact with a second circuit board, and a deflective portion formed between the fixed portion and the second contact portion. The deflective portion is adapted to deflect when the second contact portion receives a force from the second circuit board.