A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1 RU panel I/O connector attached to the cable connector.

A pin header connector having: a peripheral frame having, at the centre, a series of through openings; and a plurality of modules, each of which engages a corresponding through opening and is provided with a series of electrical pin contacts and with a support plate, which is made of a plastic material and has a series of first through holes engaged by the corresponding electrical pin contacts. The peripheral frame has a plurality of linear sliding guides, each of which is arranged in the area of a through opening, is designed to guide an insertion of the support plate of a module into the through opening allowing the support plate to only make a translation in a mounting direction, and is provided with a limit stop ending the insertion. An interlocking connection system is provided, which is activated when the support plate of each module strikes against the limit stop.

A data transmission connector (103) has a housing (30) and a plurality of data transfer plug contacts (32) that are rigid and are arranged fixedly inside the connector (103).

A data transmission connector (103) has a housing (30) and a plurality of data transfer plug contacts (32) that are rigid and are arranged fixedly inside the connector (103).

A coupler couples a first connector with a second connector wherein each of the connectors is coupled to exactly two electrical conductors. Each coupler can be utilized in a shielded (e.g., metal) or non-shielded (e.g. non-metal) form as appropriate to a specific application. Each coupler includes exactly one pair of pin contacts, preferably with a square or rectangular cross- section. Each end of the pin contacts includes four tapered faces that join at a flattened apex and are configured to be received by the tuning fork contact of the connector. The pair of pin contacts are offset from one another and cross one another within the coupler to maintain electrical polarity as electricity travels from the tuning fork contacts of a first connector to the pin contacts of the coupler and onward to the tuning fork contacts of a second connector.

A contact module includes a frame assembly having a leadframe and a dielectric frame partially encasing the leadframe. The leadframe includes ground conductors each having a transition portion extending between a mating end configured to be mated to a mating connector and a terminating end configured to be terminated to one of a circuit board or a cable conductor. The dielectric frame includes dielectric material encasing at least a portion of each transition portion. Each mating end extends from the dielectric frame for connection with the mating connector. Each terminating end extends from the dielectric frame for connection with the circuit board or the cable conductor. The contact module includes resistive elements within the dielectric frame. Each resistive element is coupled in series with the transition portion of the corresponding ground conductor.

A clamp mechanism for an RF cluster connector enables multiple RF connections within a cluster connector to be engaged and disengaged in such a way that prevents damage to the conductors. It also eases the process of engaging and disengaging through the use of two lever arms that may be easily used by a technician in challenging locations (such as at the top of a cell tower) and in densely arranged RF ports (such as for a multi-user or massive MIMO antenna).

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.

An inverter includes a case, and the case includes an upper case and a lower case attached to a bottom surface side of the upper case. The upper case includes a flange portion constituting an attachment portion of the lower case, and a connector connecting portion to which a connector is connected. The connector connecting portion includes an outer wall portion that forms an outer wall of the connector connecting portion. At least a part of the flange portion and at least a part of the outer wall portion are disposed so as to overlap each other in a direction in which the connector connecting portion and the structure face each other.