Communications jacks include at least first through third jackwire contacts and a flexible substrate that has a first finger and a second finger. The first jackwire contact and the third jackwire contact are each mounted on the first finger and the second jackwire contact is mounted on the second finger.

An apparatus comprising an interconnect comprising a conductive core; a first conductive layer connected to the conductive core and extending parallel to the conductive core towards a first end of the conductive core; a second conductive layer connected to the conductive core and extending parallel to the conductive core towards a second end of the conductive core; a first non-conductive layer between the conductive core and the first conductive layer; and a second non-conductive layer between the first conductive layer and the second conductive layer.

A connector insert comprising conductive wire and a plurality of layers of conductive and non-conductive elastomers, and methods of fabrication thereof.

Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.

Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.

A connector includes: a first spring structure having a first end which is connected to a connection part; a second spring structure including a coiled winding which is wound in the same direction as the first spring structure, the second spring structure having a first end which is connected to a connection part; a conductor to electrically connect the first spring structure and the second spring structure; and a bypass capacitor having a first electrode terminal which is connected to the first spring structure and the conductor, and a second electrode terminal which is grounded, and each turn of the winding of the first spring structure and each turn of the winding of the second spring structure are insulated from each other and arranged alternately along the same direction.

A connector includes: a first spring structure having a first end which is connected to a connection part; a second spring structure including a coiled winding which is wound in the same direction as the first spring structure, the second spring structure having a first end which is connected to a connection part; a conductor to electrically connect the first spring structure and the second spring structure; and a bypass capacitor having a first electrode terminal which is connected to the first spring structure and the conductor, and a second electrode terminal which is grounded, and each turn of the winding of the first spring structure and each turn of the winding of the second spring structure are insulated from each other and arranged alternately along the same direction.

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.