Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

An electrical connector includes a contact organizer, signal and ground contacts, and an absorber member. The contact organizer has a mating end, and includes a first wall and a second wall that define a card cavity therebetween. The card cavity is open at the mating end to receive a mating circuit card therein. The signal contacts and the ground contacts are held by the contact organizer along at least the first wall. The absorber member is mounted to the first wall of the contact organizer at the mating end. The absorber member includes at least one limb composed of a lossy material. Each limb projects into the card cavity and aligns with a corresponding one of the ground contacts. Each limb is configured to electrically connect to a corresponding ground pad of the mating circuit card.

A data network may include a data bus and network nodes. The data bus may be a differential data bus having first and second differential signal lines that convey differential signals between the nodes. A bimodal impedance terminator may be coupled to the first and second differential signal lines at one or both ends of the data bus. The bimodal impedance terminator may include a first resistor coupled between the first differential signal line and a circuit node and a second resistor coupled between the second differential signal line and the circuit node. A capacitor may be coupled between the circuit node and ground. A third resistor may be coupled between the circuit node and ground in series with the capacitor. The bimodal impedance terminator may terminate both the differential-mode impedance and the common-mode impedance of the data bus to reduce signal reflections at the ends of the data bus.

An in-line suspended power sensor coupling configuration situated within a high frequency transmission line housing that allows forward, reverse, and sampling voltage elements to all be produced simultaneously on one double sided printed circuit board (PCB). The power sensor coupling allows for calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.

An in-line suspended power sensor coupling configuration situated within a high frequency transmission line housing that allows forward, reverse, and sampling voltage elements to all be produced simultaneously on one double sided printed circuit board (PCB). The power sensor coupling allows for calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.

A power communication electrical connector is provided, comprising: a plug and a socket which are matched and plugged for connecting a power source circuit or a high-power load circuit; wherein power source connectors and the signal connectors are respectively provided on both the plug and the socket, the power source connectors are for connecting a power source of the power source circuit or a high-power load of the high-power load circuit; the signal connectors are for connecting an external chip of the power source circuit or an external chip of the high-power load circuit, wherein a power ground of the power source connectors the a signal ground of the signal connectors are separately provided. In addition, an anti-spark power communication electrical connector is further provided.

A power communication electrical connector is provided, comprising: a plug and a socket which are matched and plugged for connecting a power source circuit or a high-power load circuit; wherein power source connectors and the signal connectors are respectively provided on both the plug and the socket, the power source connectors are for connecting a power source of the power source circuit or a high-power load of the high-power load circuit; the signal connectors are for connecting an external chip of the power source circuit or an external chip of the high-power load circuit, wherein a power ground of the power source connectors the a signal ground of the signal connectors are separately provided. In addition, an anti-spark power communication electrical connector is further provided.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.