A backplane connector includes a number of wafers and a spacer for assembling the number of wafers together. Each wafer includes an insulating frame. The insulating frame includes a first protrusion. The spacer includes a body portion. The body portion has a number of slots for holding the first protrusions of the wafers. A periphery of each slot is surrounded by the body portion. Compared with the prior art, the spacer of the present disclosure is provided with a number of slots for holding the first protrusions of the wafers. As a result, the wafers can be easily assembled and fixed as a whole.

An electrical connector contains a first contact group arranged on a first contact plane, a second contact group arranged on a second contact plane and a ground plate located on a ground plane. The ground plate is located between horizontally extending portions of the contacts of the first contact group and horizontally extending portions, downwardly extending portions and terminal portions of the contacts of the second contact group in addition to between contacting portions and the horizontally extending portions of the contacts of the first contact group and contacting portions and the horizontally extending portions of the contacts of the second contact group.

A backplane connector includes a number of wafers. Each wafer includes a number of conductive terminals, a first metal shield and a second metal shield. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal has a contact portion. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The first extension portion and/or the second extension portion include a limiting structure for limiting the contact portion of the first ground terminal and/or the contact portion of the second ground terminal. Besides, in two adjacent wafers, the first extension portion of one wafer contacts the second extension portion of the other wafer through protruding tabs. As a result, the structural reliability of the backplane connector is improved.

A backplane connector includes a number of wafers and a spacer for assembling the wafers together. Each wafer includes an insulating frame and a number of conductive terminals fixed to the insulating frame. The insulating bracket includes a first protrusion and a second protrusion. The spacer includes a first body portion and a second body portion. The first body portion includes a first clamping slot for clamping the first protrusion. The second body portion includes a second clamping slot for clamping the second protrusion. The present disclosure increases the ability of the spacer to resist external forces and improves the structural stability of the backplane connector.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first extension portion and the second extension portion in contact with the first ground terminal and the second ground terminal. As a result, a shielding space to enclose contact portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

A circuit board includes two first insertion holes, a second insertion hole located on one side of the two first insertion holes, a third insertion hole located on the other side of the two first insertion holes, and a number of grounding points. The grounding points are distributed on a periphery of the first insertion holes. The grounding points, the second insertion hole and the third insertion hole together form a shielding layer surrounding the periphery of the first insertion holes. The present disclosure also relates to a backplane connector assembly having a backplane connector and the circuit board. Compared with the prior art, the circuit board disclosed in the present disclosure improves the shielding effect of differential signal terminals, reduces crosstalk and improves the quality of signal transmission.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first extension portion. The second metal shield has a second extension portion. The backplane connector includes an insulating block sleeved on the contact portions of the differential signal terminal and a metal shell sleeved on the insulating block. The metal shell is in contact with the first extension portion and the second extension portion. This arrangement increases the grounding shielding area, reduces crosstalk and improves the quality of signal transmission.

A terminal assembly and an electrical connector, the terminal assembly comprises a plurality of ground terminals, a plurality of signal terminals, and an insulating body. Each ground terminal comprises a ground terminal body, a ground pin, and a plurality of ground assembling pins. The plurality of signal terminals and the plurality of ground terminals are alternately arranged and disposed at intervals along a first direction. At least one signal terminal is disposed between two adjacent ground terminals. Each signal terminal comprises a signal terminal body, a signal pin, and a signal assembling pin. The insulating body is disposed on the plurality of ground terminal bodies and the plurality of signal terminal bodies. A plurality of first distances exist between the plurality of ground pins and the plurality of signal pins. A plurality of second distances exist between the plurality of ground assembling pins and the plurality of signal assembling pins.

A floating connector comprises a movable housing, a regulating member and a plurality of contacts. Each of the contacts is made of a single metal plate. Each of the contacts has a fixed portion, a regulated portion, a held portion, an extending portion, a contact portion and a coupling portion. The coupling portion is resiliently deformable. The movable housing is movable within a predetermined range in a plane perpendicular to an up-down direction by the resilient deformation of the coupling portion. The coupling portion has a first portion, a second portion and a bent portion. Each of the first portion and second portion has a principal surface. The principal surface of the first portion faces in a first direction. The principal surface of the second portion faces in a second direction. The first direction and the second direction are different from each other.

An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.