Patent classifications
H01R13/6598
High density connector
High density pluggable electrical connector having a number of electrical contacts exceeding sixty and a contact density on a plugging interface of the connector of at least forty contacts per square centimeter, comprising a casing and a terminal unit mounted within the casing, the terminal unit comprising a housing with a module receiving cavity formed within the housing, and a plurality of terminal modules insertably received in the module receiving cavity in a stacked arrangement. Each terminal module comprises a plurality of contacts mounted in a dielectric terminal module housing, the terminal modules having a width W to height H ratio W/H greater than three.
Method for shielding and grounding a connector assembly from electromagnetic interference (EMI) using a male/female joint stamped shield and conductive seal
A method for shielding and grounding a connector assembly from electromagnetic interference (EMI) including at least one of a step of directing the EMI to at least an electrically conducting seal, and a step of directing the EMI to at least a male/female joint stamped shield. The EMI, generated by, e.g., at least a battery cable assembly or the like, housed within at least a male connector assembly or a female connector assembly of the connector assembly, has a flow path that is conducted through at least the electrically conductive seal and the male/female joint stamped shield of the connector assembly.
Method for shielding and grounding a connector assembly from electromagnetic interference (EMI) using a male/female joint stamped shield and conductive seal
A method for shielding and grounding a connector assembly from electromagnetic interference (EMI) including at least one of a step of directing the EMI to at least an electrically conducting seal, and a step of directing the EMI to at least a male/female joint stamped shield. The EMI, generated by, e.g., at least a battery cable assembly or the like, housed within at least a male connector assembly or a female connector assembly of the connector assembly, has a flow path that is conducted through at least the electrically conductive seal and the male/female joint stamped shield of the connector assembly.
Compliant shield for very high speed, high density electrical interconnection
An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
Compliant shield for very high speed, high density electrical interconnection
An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
Connectors For High Density Neural Interfaces
The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a core and a supporting structure wrapped around at least a portion of the core. The supporting structure may have a first layer of a high temperature liquid crystal polymer, and the second layer of a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core. Conductive traces are buried between the first layer and the second layer, and the conductive traces terminate at conductive contacts formed on a surface of the first layer. The connector may have a predetermined shape or profile, which facilitates alignment and insertion of the connector into a header of a neurostimulator.
Connectors For High Density Neural Interfaces
The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a core and a supporting structure wrapped around at least a portion of the core. The supporting structure may have a first layer of a high temperature liquid crystal polymer, and the second layer of a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core. Conductive traces are buried between the first layer and the second layer, and the conductive traces terminate at conductive contacts formed on a surface of the first layer. The connector may have a predetermined shape or profile, which facilitates alignment and insertion of the connector into a header of a neurostimulator.
ELECTRICAL CONNECTOR WITH IMPROVED ELECTRICAL PERFORMANCE
The present disclosure provides an electrical connector including an insulating housing, a number of terminals and a lossy member. The terminals include a number of ground terminals and a number of signal terminals. The ground terminals and the signal terminals are set adjacently to each other but do not contact each other. The ground terminals do not directly contact the lossy member. As a result, installation consistency of the ground terminals can be achieved, thereby improving the electrical performance of the electrical connector.
Shielded electrical connector assembly and method of manufacturing same
A shielded electrical connector assembly includes an electromagnetic shield integrally formed from a single sheet of conductive material. The shield has a main wall and four side walls surrounding the main wall. The shield defines an opening opposite the main wall having an opening perimeter that is greater than or equal to a main wall perimeter. One of the four side walls defines at least one side wall opening that is configured to receive a shielded wire cable. A method of manufacturing the shielded electrical connector assembly includes the steps of providing a single planar sheet of conductive material, providing a die and a punch, forming the sheet into a cupped shape having a main wall and four side walls surrounding the main wall using the die and the punch, and forming a side wall opening in one of the four side walls.
Shielded electrical connector assembly and method of manufacturing same
A shielded electrical connector assembly includes an electromagnetic shield integrally formed from a single sheet of conductive material. The shield has a main wall and four side walls surrounding the main wall. The shield defines an opening opposite the main wall having an opening perimeter that is greater than or equal to a main wall perimeter. One of the four side walls defines at least one side wall opening that is configured to receive a shielded wire cable. A method of manufacturing the shielded electrical connector assembly includes the steps of providing a single planar sheet of conductive material, providing a die and a punch, forming the sheet into a cupped shape having a main wall and four side walls surrounding the main wall using the die and the punch, and forming a side wall opening in one of the four side walls.