H01R13/6598

CROSSTALK SHIELD
20200412064 · 2020-12-31 · ·

Technologies are described for devices and methods to prevent crosstalk. The devices may comprise a first and a second electromagnetic interference shield, each effective to prevent crosstalk between inner contacts and each may include a first flat plate and a second flat plate connected at a bend. The device may comprise an inner insulator. The inner insulator may include walls defining slots configured to receive the first and second electromagnetic interference shields and walls defining cavities configured to secure inner contacts to the inner insulator. The device may comprise the inner contacts and an outer insulator. The outer insulator may be configured to slide over and attach to the inner insulator. The device may comprise a ferrule and an outer body. The outer body may be configured to enclose the outer insulator, the inner insulator, the inner contacts, the electromagnetic interference shields, and at least part of the ferrule.

CONNECTOR

A connector includes an insulated member, a plurality of first conductive terminals, a plurality of second conductive terminals, a shielding shell, and a metal housing. The first conductive terminals are disposed on an upper surface of the insulated member and extending rearward. The second conductive terminals are disposed on a lower surface of the insulated member, extending rearward, and located below the first conductive terminals. The shielding shell is fitted over the insulated member, and the shielding shell has a plug end and a mounting end. The metal housing has a plurality of grounding structures, the metal housing is fitted over the mounting end of the shielding shell, and the grounding structures are completely located below the second conductive terminals.

CONNECTOR

A connector includes an insulated member, a plurality of first conductive terminals, a plurality of second conductive terminals, a shielding shell, and a metal housing. The first conductive terminals are disposed on an upper surface of the insulated member and extending rearward. The second conductive terminals are disposed on a lower surface of the insulated member, extending rearward, and located below the first conductive terminals. The shielding shell is fitted over the insulated member, and the shielding shell has a plug end and a mounting end. The metal housing has a plurality of grounding structures, the metal housing is fitted over the mounting end of the shielding shell, and the grounding structures are completely located below the second conductive terminals.

Connecting device for connecting and grounding coaxial cable connectors
10855003 · 2020-12-01 · ·

A connecting device configured to be installed on a first coaxial cable connector to facilitate connection of the first connector to a second connector and to maintain ground continuity across the connectors. In some embodiments, the connecting device includes a grounding element disposed in a gripping member, the grounding element including one or more projections configured to extend beyond an end of the gripping member to conductively engage an outer surface of the second connector.

High speed, high density electrical connector with shielded signal paths

A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.

High speed, high density electrical connector with shielded signal paths

A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.

High voltage connector and method for assembling thereof
10819073 · 2020-10-27 · ·

A high voltage connector, connected to a device, that experiences a reduced electromagnetic interference (EMI), avoids galvanic corrosion of dissimilar metals within or without a fluid environment, and provides an effective electrical ground system. The connector includes an outer housing assembly, an inner housing mounted inside the outer housing, a set of cable reinforcement retainer assemblies secured inside the inner housing, a back cover through which the cables respectively slide along and covers a central opening of the outer housing, a braided shield covering the cables, and a clamp that connects the shield onto the outer housing. When assembling the high voltage connector, the outer housing is mounted onto the device; the inner housing is secured inside the outer housing; the set of cable reinforcement retainer assemblies with associated cables is secured in and extends in a substantially horizontal direction from the inner housing; a back cover is slid along the cables, and enters and covers a central opening of the outer housing; and a braided shield is mounted and connected to the outer housing by a clamp.

VERY HIGH SPEED, HIGH DENSITY ELECTRICAL INTERCONNECTION SYSTEM WITH BROADSIDE SUBASSEMBLIES

A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion. Broadside coupling provides balanced pairs for very high frequency operation. The connector may be assembled with multiple subassemblies, each of which may have multiple pairs of signal conductors. The subassemblies may be formed from an insulative portion having grooves in opposite sides into which the intermediate portions of signal conductors. Covers, holding the signal conductors in the grooves, may establish the position of the signal conductors relative to reference conductors at the exterior of subassembly, so as to provide a controlled impedance. Lossy material may be positioned between the pairs in a subassembly and/or may contact the reference conductors of the subassemblies, and the lossy material of the subassemblies may in turn be connected with a conductive structure.

COMPLIANT SHIELD FOR VERY HIGH SPEED, HIGH DENSITY ELECTRICAL INTERCONNECTION

An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.

COMPLIANT SHIELD FOR VERY HIGH SPEED, HIGH DENSITY ELECTRICAL INTERCONNECTION

An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.