An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

It is aimed to suppress water intrusion into an internal accommodation space for accommodating a ferrite and the adhesion of water to a male terminal by providing a sealing member. A connector (10) includes an inner housing (16), an outer housing 14 including a rear receptacle (30) into which the inner housing (16) is fit, and ferrites (12) including ferrite-side insertion holes (48) through which busbars (18) are inserted. The ferrites (12) are accommodated into internal accommodation spaces (S) formed inside by the inner housing (16) and the rear receptacle (30) in a fit state. A sealing member (20) is sandwiched between the rear receptacle (30) and the inner housing (16) to suppress water intrusion into the internal accommodation spaces (S).

A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

An electronic device comprising a USB port and a PCB is provided. A first cabling layer of the PCB has a first floating area and a line outside the first floating area, an insulation medium is between the first floating area and the line, a second cabling layer of the PCB is adjacent to the first cabling layer and has a first metal area, an orthographic projection of the first floating area on the second cabling layer and the first metal area have an overlapping area, and the first floating area is not connected to the first metal area; and a metal housing of the USB port has a plurality of fixed contacts fastened to the PCB and not connected to a ground of the PCB, the contacts include a first fixed contact connected to the first floating area and not connected to the first metal area.

A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

A method of forming a fluid resistant insulator for use in a connector includes collecting a part having a surface and electrically insulating properties. The method further includes applying a superhydrophobic sealant to the surface of the part having the electrically insulating properties. The method further includes curing the part with the superhydrophobic sealant applied to allow the superhydrophobic sealant to dry.

A connector is equipped with a housing capable of being fitted in a mating connector, a plurality of terminals which are held in the housing and electrically connected to each other, and a noise reduction member or members which are held in the housing. The mating connector is connected to brunch lines among a trunk line and the brunch lines constituting an electric circuit. One of the plurality of terminals is a trunk-line connection terminal which is a pressure contact terminal and is electrically connected to the trunk line directly, and a remaining terminals are branch-line connection terminals which are male terminals or female terminals and are electrically connected to the respective branch lines when the housing is connected to the mating connector. The noise reduction member is not disposed at the trunk-line connection terminal, and the noise reduction member is disposed at the branch-line connection terminal.