Patent classifications
H01R33/225
Electric connecting member and LED lamp using the same
An electric connecting member and an LED lamp using the electric connecting member are provided. The electric connecting member is used for the electric connection between a light source substrate and a driving board of the LED lamp, and comprises an input terminal and an output terminal. The LED lamp comprises the driving board and the light source substrate. The output terminal is provided on the driving board of the LED lamp. The input terminal is disposed upon the light source substrate and is electrically connected to the light source substrate. The output terminal comprises two contacts, and one end of each of the two contacts is electrically connected to the driving board respectively. The input terminal comprises two connection heads which are respectively provided corresponding to the two contacts. One end of each of the two connection heads is electrically connected to the light source substrate respectively.
ELECTRICAL CONNECTING TERMINAL USED TO CONNECT DRIVING BOARD WITH LAMP HOLDER OF LED LAMP
An electrical connecting terminal used to connect a driving board with a lamp holder of an LED lamp has a base, an elastic sheet, and a plug pin (or a weld pin). A side of the base extends upwards and obliquely and is curved to form the elastic sheet adapted for electrical connection of an electrode of the lamp holder. The side of the base extends outward or is bent to form the plug pin or the weld pin adapted for electrical connection of the driving board. The structure and connecting procedure are simple, the assembly efficiency is high, the connection is stable, and the yield is increased greatly.
Power module with press-fit contacts
A method of forming a semiconductor device includes providing a power electronics carrier including a structured metallization layer disposed on an electrically insulating substrate, mounting one or more semiconductor dies on a portion of the structured metallization layer, forming an encapsulant body of electrically insulating material that covers the power electronics carrier and encapsulates the one or more semiconductor dies, securing a press-fit connector to the power electronics carrier with a base portion of the press-fit connector being disposed within an opening in the encapsulant body and with an interfacing end of the press-fit connector being electrically accessible from outside the encapsulant body.