A connection system for a portable electronic device may allow for modular components to be coupled together. A primary module may comprise computing components, such as a processor, hard drive, wireless chip, battery, etc. Various secondary modules may be removably coupled to the primary module, such as batteries, charging stations, storage units, LTE hotspot devices, cover plates, cameras, virtual reality units, speakers, video screens, user interfaces, etc. The secondary modules may comprise connection posts which mate with receiving slots in the primary module to couple the primary and secondary components together.

A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

An electrical component socket includes a socket body arranged on a circuit board and including a receiving portion configured to receive an electrical component. The socket body includes an arrangement portion in which a row of contact pins to be in contact with leads of an IC package is arranged. At least one of these contact pins and another one of the contact pins adjacent to the at least one of the contact pins have an arrangement pitch that is narrower than a pitch between the terminals of the electrical component, and the other one of the contact pins and still another one of the contact pins adjacent to the other one of the contact pins have an arrangement pitch that is substantially equal to the pitch between the terminals of the electrical component.

A mounting assembly for an electrical fixture has an upper unit and a lower unit. The upper unit includes a first portion of a detent mechanism and an upper contact for connection to a power source. The lower unit is configured for connection to an electrical fixture and includes a second portion of a detent mechanism and a lower contact for connection to the electrical fixture. When the lower unit engages the upper unit, the first portion and the second portion of the detent mechanism cooperate to releasably retain the upper unit and lower unit together and the upper contact and lower contact touch to create an electric pathway between the power source and the electrical fixture.

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

An electrical connector includes an insulating body having a bottom wall and a first terminal and a second terminal accommodated in the insulating body along a vertical direction. The bottom wall has a first abutting portion. The first terminal has a first abutting arm, and the second terminal has a second abutting arm. The first abutting portion is located between the first abutting arm and the second abutting arm. The first abutting arm and the first abutting surface clamp a first solder, and the first abutting arm exerts a first acting force directed toward the first abutting portion on the first solder. The second abutting arm and the second abutting surface clamp a second solder, and the second abutting arm exerts a second acting force directed toward the first abutting portion on the second solder.