The present disclosure disclosed a conductive slip ring including a first terminal group and a second terminal group. The first terminal group includes a first terminal and a second terminal. The first terminal has a first contact portion provided with a first annular contact surface. The second terminal has a second contact portion provided with a second annular contact surface. The second terminal group includes a third terminal and a fourth terminal. The third terminal is in rotating contact with the first annular contact surface of the first terminal. The fourth terminal is in rotating contact with the second annular contact surface of the second terminal. The first annular contact surface and the second annular contact surface are spaced apart from each other along an axial direction of the conductive slip ring. As a result, structure of the conductive slip ring can be made in a more compact manner.

The present disclosure disclosed a conductive slip ring including a first terminal group and a second terminal group. The first terminal group includes a first terminal and a second terminal. The first terminal has a first contact portion provided with a first annular contact surface. The second terminal has a second contact portion provided with a second annular contact surface. The second terminal group includes a third terminal and a fourth terminal. The third terminal is in rotating contact with the first annular contact surface of the first terminal. The fourth terminal is in rotating contact with the second annular contact surface of the second terminal. The first annular contact surface and the second annular contact surface are spaced apart from each other along an axial direction of the conductive slip ring. As a result, structure of the conductive slip ring can be made in a more compact manner.

A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

The present disclosure disclosed a conductive slip ring including a first terminal group and a second terminal group. The first terminal group includes a first terminal and a second terminal. The first terminal has a first contact portion provided with a first annular contact surface. The second terminal has a second contact portion provided with a second annular contact surface. The second terminal group includes a third terminal and a fourth terminal. The third terminal is in rotating contact with the first annular contact surface of the first terminal. The fourth terminal is in rotating contact with the second annular contact surface of the second terminal. The first annular contact surface and the second annular contact surface are spaced apart from each other along an axial direction of the conductive slip ring. As a result, structure of the conductive slip ring can be made in a more compact manner.

A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

A slip ring device includes an insulating molded body in which a pair of slip rings and a pair of connecting conductors are provided. The insulating molded body includes a molded body main body portion disposed in a position further from a rotor main body than a bearing provided on a shaft, the slip rings being provided in the molded body main body portion, an opposing portion disposed between the bearing and the rotor main body, and a pair of beam portions that connect the molded body main body portion to the opposing portion, the connecting conductors being provided respectively in the beam portions. A pair of shaft grooves respectively accommodating the pair of beam portions are provided in the shaft. A spreading suppression portion for preventing resin with which a field coil is impregnated from spreading into the shaft grooves is provided in the opposing portion.

A slip ring device includes an insulating molded body in which a pair of slip rings and a pair of connecting conductors are provided. The insulating molded body includes a molded body main body portion disposed in a position further from a rotor main body than a bearing provided on a shaft, the slip rings being provided in the molded body main body portion, an opposing portion disposed between the bearing and the rotor main body, and a pair of beam portions that connect the molded body main body portion to the opposing portion, the connecting conductors being provided respectively in the beam portions. A pair of shaft grooves respectively accommodating the pair of beam portions are provided in the shaft. A spreading suppression portion for preventing resin with which a field coil is impregnated from spreading into the shaft grooves is provided in the opposing portion.

In a rotor of the present invention, an interference is set to have a relationship so that an inner diameter of a press-fit projecting portion before press-fitting is smaller than a diameter of a shaft, and in the inner wall surface, a non-projecting portion is formed without projecting portions on a portion in which a weld line is generated by the molding.

In a rotor of the present invention, an interference is set to have a relationship so that an inner diameter of a press-fit projecting portion before press-fitting is smaller than a diameter of a shaft, and in the inner wall surface, a non-projecting portion is formed without projecting portions on a portion in which a weld line is generated by the molding.