A semiconductor laser module includes: an optical fiber that outputs a first laser beam to an exterior of the semiconductor laser module; semiconductor laser devices each including an emission portion that emits a second laser beam, an electrically conductive portion that supplies electric power to the emission portion, and a mount on which the emission portion and the electrically conductive portion are disposed; a mount base including mount surfaces that form steps; and an optical system that optically couples the second laser beams from the emission portions to an incident end face of the optical fiber. The mounts of the semiconductor laser devices are disposed on the mount surfaces. The semiconductor laser devices include an upper semiconductor laser device and a lower semiconductor laser device adjacent to each other in a step direction of the mount base.

A laser diode driving circuit includes a switching element, a controller configured to turn on an off the switching element, a second series circuit connected in parallel with a first series circuit including a laser diode, and a capacitor. The second series circuit includes a rectifying element and a current limiter configured to limit a current passing through the rectifying element, and is connected in parallel with the first series circuit such that the direction pointing from the anode to the cathode of the rectifying element is opposite to the direction pointing from the anode to the cathode of the laser diode. The capacitor is configured to be charged when the switching element is off and to form a closed circuit with the switching element and the first and second series circuits when the switching element is on.

An optical assembly comprising an interdigital capacitor, one or more electrical contacts in electrical connection with the interdigital capacitor and an insulating layer covering at least a portion of the interdigital capacitor. The one or more electrical contacts and a portion of the insulating layer are configured to receive conductive adhesive. The optical assembly further comprises a metallic layer positioned between the interdigital capacitor and the portion of the insulating layer configured to receive the conductive adhesive.

An optical assembly comprising an interdigital capacitor, one or more electrical contacts in electrical connection with the interdigital capacitor and an insulating layer covering at least a portion of the interdigital capacitor. The one or more electrical contacts and a portion of the insulating layer are configured to receive conductive adhesive. The optical assembly further comprises a metallic layer positioned between the interdigital capacitor and the portion of the insulating layer configured to receive the conductive adhesive.

The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).

A laser package is described, the laser package comprising a plurality of laser diodes separately attached to at least one sub-mount having respective connecting pads, wherein, during operation, each of the laser diodes emits light having a fast axis and a slow axis defining a fast axis plane and a slow axis plane, wherein the fast axis planes of all laser diodes are parallel to each other and the distance between the fast axis planes of at least two laser diodes is smaller than the lateral distance between these laser diodes. Furthermore, a system with at least two laser packages is described.

Disclosed is a color emissive LED array having a substantially flat backplane which has circuitry. The color emissive LED array includes a plurality of multi thickness color emissive LED units disposed in an array on the substantially flat backplane; The plurality of multi thickness color emissive LED units have a thickness of the first color emissive LED unit is less than a thickness of the second color emissive LED unit and less than a thickness of the third color emissive LED unit. Meanwhile, the substantially flat backplane having circuitry has one or more anode and one or more cathode. Further, the array is attached to the substantially flat backplane having circuitry by using a jointing layer.

The present disclosure provides a method for manufacturing a diffusion cover that diffuses and transmits light from a semiconductor light-emitting element. The method includes the steps of preparing a base member having an obverse surface and a reverse surface that face away from each other in a thickness direction; forming a lens material on the obverse surface, the lens material containing a photosensitive transparent resin; and removing a portion of the lens material by performing grayscale exposure and development, and forming a lens having a plurality of lens members. Such a configuration can provide a diffusion cover suitable for reducing the manufacturing cost.

An optoelectronic semiconductor chip comprises a semiconductor body including a plurality of active regions configured to generate electromagnetic radiation, the plurality of active regions being arranged in a horizontal plane. The optoelectronic semiconductor chip further comprises a conductive member configured to electrically connect at least two adjacent ones of the active regions with each other, the conductive member being arranged over a first main surface of the semiconductor body. The optoelectronic semiconductor chip further comprises a contact element extending from the first main surface to a second main surface of the semiconductor body and being electrically connected to at least one of the active regions via a contact material over the first main surface, and an optical element arranged over the first main surface of the semiconductor body.

A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which one or more optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which one or more optoelectronic devices is disposed to form an angle between the surface of the first board on which one or more optoelectronic devices is disposed and the surface of the second board on which one or more optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.