H01S5/0235

Optical member holding device, semiconductor laser device, method of manufacturing optical member holding device, and method of manufacturing semiconductor laser device
11626705 · 2023-04-11 · ·

An optical member holding device including a holding member, an optical member and an elastic member. The holding member has a recess defined by one or more lateral surfaces and a bottom surface with a through-hole opening at the bottom surface. The optical member is disposed on the bottom surface, and includes a light transmissive part. The optical member has an upper surface and one or more lateral surfaces. The elastic member consists of an inorganic material, and has a wavelike shape and disposed between the one or more lateral surfaces of the recess and the one or more lateral surfaces of the optical member so as to be in contact with the one or more lateral surfaces of the recess and the one or more lateral surfaces of the optical member to exert elastic force that secures the optical member to a predetermined location in the recess.

Electronic device with heat-radiant structure

An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.

Electronic device with heat-radiant structure

An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.

METHOD OF MANUFACTURING LIGHT EMITTING MODULE, LIGHT EMITTING MODULE, AND PROJECTOR
20230071897 · 2023-03-09 · ·

A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

METHOD OF MANUFACTURING LIGHT EMITTING MODULE, LIGHT EMITTING MODULE, AND PROJECTOR
20230071897 · 2023-03-09 · ·

A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

LASER-BASED LIGHT GUIDE-COUPLED WIDE-SPECTRUM LIGHT SYSTEM

A laser-based fiber-coupled wide-spectrum light system is provided. The system includes a laser device and one or more phosphor members configured and arranged to provide wide-spectrum emissions. One or more fibers are configured and arranged to receive the wide-spectrum emissions.

Light emitting device
11644178 · 2023-05-09 · ·

A light emitting device includes a base, a first light emitting element and a first light reflecting member disposed on the base and a lens member. The first light reflecting member is positioned with respect to the first light emitting element so that emitted light from the first light emitting element is divided into a portion of the emitted light from the first light emitting element irradiating onto the light reflecting face and a portion of the emitted light from the first light emitting element traveling outside of the light reflecting face by having an edge of the light reflecting face serve as a boundary. The lens member includes a reflected light passing region having a first lens shape configured to control the travelling direction of reflected light, and a non-reflected light passing region having a second lens shape configured to control a travelling direction of non-reflected light.

Light emitting device
11644178 · 2023-05-09 · ·

A light emitting device includes a base, a first light emitting element and a first light reflecting member disposed on the base and a lens member. The first light reflecting member is positioned with respect to the first light emitting element so that emitted light from the first light emitting element is divided into a portion of the emitted light from the first light emitting element irradiating onto the light reflecting face and a portion of the emitted light from the first light emitting element traveling outside of the light reflecting face by having an edge of the light reflecting face serve as a boundary. The lens member includes a reflected light passing region having a first lens shape configured to control the travelling direction of reflected light, and a non-reflected light passing region having a second lens shape configured to control a travelling direction of non-reflected light.

Multi kW class blue laser system

The invention may be embodied in other forms than those specifically disclosed herein without departing from itMulti-kW-class blue (400-495 nm) fiber-delivered lasers and module configurations. In embodiments, the lasers propagate laser beams having beam parameter products of <5 mm*mrad, which are used in materials processing, welding and pumping a Raman laser. In an embodiment the laser system is an integration of fiber-coupled modules, which are in turn made up of submodules. An embodiment has sub-modules having a plurality of lensed blue semiconductor gain chips with low reflectivity front facets. These are locked in wavelength with a wavelength spread of <1 nm by using volume Bragg gratings in an external cavity configuration. An embodiment has modules having of a plurality of submodules, which are combined through wavelength multiplexing with a bandwidth of <10 nm, followed by polarization beam combining. The output of each module is fiber-coupled into a low NA fiber. In an embodiment a kW-level blue laser system is realized by fiber bundling and combining multiple modules into a single output fiber.

LASER SOURCE ASSEMBLY WITH THERMAL CONTROL AND MECHANICALLY STABLE MOUNTING

A laser source (340) that generates an output beam (354) that is directed along a beam axis (354A) that is coaxial with a first axis and orthogonal to a second axis comprises a first frame (356), a laser (358), and a first mounting assembly (360). The laser (358) generates the output beam (354) that is directed along the beam axis (354A). The first mounting assembly (360) couples the laser (358) to the first frame (356). The first mounting assembly (360) allows the laser (358) to expand and contract relative to the first frame (356) along the first axis and along the second axis, while maintaining alignment of the output beam (354) so the beam axis (354A) is substantially coaxial with the first axis. The first mounting assembly (360) can include a first fastener assembly (366) that couples the laser (358) to the first frame (356), and a first alignment assembly (368) that maintains alignment of the laser (358) along a first alignment axis (370) that is substantially parallel to the first axis.